经国务院同意，现将《国家集成电路产业发展推进纲要》公布如下：
国家集成电路产业发展推进纲要
集成电路产业是信息技术产业的核心，是支撑经济社会发展和保障国家安全的战略性、基础性和先导性产业，当前和今后一段时期是我国集成电路产业发展的重要战略机遇期和攻坚期，为加快推进我国集成电路产业发展，特制定本纲要。
一、现状与形势
近年来，在市场拉动和政策支持下，我国集成电路产业快速发展，整体实力显著提升，集成电路设计、制造能力与国际先进水平差距不断缩小，封装测试技术逐步接近国际先进水平，部分关键装备和材料被国内外生产线采用，涌现出一批具备一定国际竞争力的骨干企业，产业集聚效应日趋明显。但是，集成电路产业仍然存在芯片制造企业融资难、持续创新能力薄弱、产业发展与市场需求脱节、产业链各环节缺乏协同、适应产业特点的政策环境不完善等突出问题，产业发展水平与先进国家（地区）相比依然存在较大差距，集成电路产品大量依赖进口，难以对构建国家产业核心竞争力、保障信息安全等形成有力支撑。
当前，全球集成电路产业正进入重大调整变革期。一方面，全球市场格局加快调整，投资规模迅速攀升，市场份额加速向优势企业集中。另一方面，移动智能终端及芯片呈爆发式增长，云计算、物联网、大数据等新业态快速发展，集成电路技术演进出现新趋势；我国拥有全球规模最大的集成电路市场，市场需求将继续保持快速增长。新形势下，我国集成电路产业发展既面临巨大的挑战，也迎来难得的机遇，应充分发挥市场优势，营造良好发展环境，激发企业活力和创造力，带动产业链协同可持续发展，加快追赶和超越的步伐，努力实现集成电路产业跨越式发展。
二、总体要求
（一）指导思想。
以邓小平理论、“三个代表”重要思想、科学发展观为指导，深入学习领会党的十八大和十八届二中、三中全会精神，贯彻落实党中央和国务院的各项决策部署，使市场在资源配置中起决定性作用，更好发挥政府作用，突出企业主体地位，以需求为导向，以整机和系统为牵引、设计为龙头、制造为基础、装备和材料为支撑，以技术创新、模式创新和体制机制创新为动力，破解产业发展瓶颈，推动集成电路产业重点突破和整体提升，实现跨越发展，为经济发展方式转变、国家安全保障、综合国力提升提供有力支撑。
（二）基本原则。
需求牵引。依托市场优势，面向量大面广的重点整机和信息消费需求，提升企业的市场适应能力和有效供给水平，构建“芯片—软件—整机—系统—信息服务”产业链。
创新驱动。强化企业技术创新主体地位，加大研发力度，结合国家科技重大专项实施，突破一批集成电路关键技术，协同推进机制创新和商业模式创新。
软硬结合。强化集成电路设计与软件开发的协同创新，以硬件性能的提升带动软件发展，以软件的优化升级促进硬件技术进步，推动信息技术产业发展水平整体提升。
重点突破。强化市场需求与技术开发的结合，实现涉及国家安全及市场潜力大、产业基础好的关键领域快速发展。
开放发展。充分利用全球资源，推进产业链各环节开放式创新发展，加强国际交流合作，提升在全球产业竞争格局中的地位和影响力。
（三）发展目标。 到2015年，集成电路产业发展体制机制创新取得明显成效，建立与产业发展规律相适应的融资平台和政策环境。集成电路产业销售收入超过3500亿元。移动智能终端、网络通信等部分重点领域集成电路设计技术接近国际一流水平。32/28纳米（nm）制造工艺实现规模量产，中高端封装测试销售收入占封装测试业总收入比例达到30%以上，65-45nm关键设备和12英寸硅片等关键材料在生产线上得到应用。
到2020年，集成电路产业与国际先进水平的差距逐步缩小，全行业销售收入年均增速超过20%，企业可持续发展能力大幅增强。移动智能终端、网络通信、云计算、物联网、大数据等重点领域集成电路设计技术达到国际领先水平，产业生态体系初步形成。16/14nm制造工艺实现规模量产，封装测试技术达到国际领先水平，关键装备和材料进入国际采购体系，基本建成技术先进、安全可靠的集成电路产业体系。
到2030年，集成电路产业链主要环节达到国际先进水平，一批企业进入国际第一梯队，实现跨越发展。
三、主要任务和发展重点
（一）着力发展集成电路设计业。围绕重点领域产业链，强化集成电路设计、软件开发、系统集成、内容与服务协同创新，以设计业的快速增长带动制造业的发展。近期聚焦移动智能终端和网络通信领域，开发量大面广的移动智能终端芯片、数字电视芯片、网络通信芯片、智能穿戴设备芯片及操作系统，提升信息技术产业整体竞争力。发挥市场机制作用，引导和推动集成电路设计企业兼并重组。加快云计算、物联网、大数据等新兴领域核心技术研发，开发基于新业态、新应用的信息处理、传感器、新型存储等关键芯片及云操作系统等基础软件，抢占未来产业发展制高点。分领域、分门类逐步突破智能卡、智能电网、智能交通、卫星导航、工业控制、金融电子、汽车电子、医疗电子等关键集成电路及嵌入式软件，提高对信息化与工业化深度融合的支撑能力。
（二）加速发展集成电路制造业。抓住技术变革的有利时机，突破投融资瓶颈，持续推动先进生产线建设。加快45/40nm芯片产能扩充，加紧32/28nm芯片生产线建设，迅速形成规模生产能力。加快立体工艺开发，推动22/20nm、16/14nm芯片生产线建设。大力发展模拟及数模混合电路、微机电系统（MEMS）、高压电路、射频电路等特色专用工艺生产线。增强芯片制造综合能力，以工艺能力提升带动设计水平提升，以生产线建设带动关键装备和材料配套发展。
（三）提升先进封装测试业发展水平。大力推动国内封装测试企业兼并重组，提高产业集中度。适应集成电路设计与制造工艺节点的演进升级需求，开展芯片级封装（CSP）、圆片级封装（WLP）、硅通孔（TSV）、三维封装等先进封装和测试技术的开发及产业化。
（四）突破集成电路关键装备和材料。加强集成电路装备、材料与工艺结合，研发光刻机、刻蚀机、离子注入机等关键设备，开发光刻胶、大尺寸硅片等关键材料，加强集成电路制造企业和装备、材料企业的协作，加快产业化进程，增强产业配套能力。
四、保障措施
（一）加强组织领导。成立国家集成电路产业发展领导小组，负责集成电路产业发展推进工作的统筹协调，强化顶层设计，整合调动各方面资源，解决重大问题。成立咨询委员会，对产业发展的重大问题和政策措施开展调查研究，进行论证评估，提供咨询建议。
（二）设立国家产业投资基金。国家产业投资基金（以下简称基金）主要吸引大型企业、金融机构以及社会资金，重点支持集成电路等产业发展，促进工业转型升级。基金实行市场化运作，重点支持集成电路制造领域，兼顾设计、封装测试、装备、材料环节，推动企业提升产能水平和实行兼并重组、规范企业治理，形成良性自我发展能力。支持设立地方性集成电路产业投资基金。鼓励社会各类风险投资和股权投资基金进入集成电路领域。
（三）加大金融支持力度。积极发挥政策性和商业性金融的互补优势，支持中国进出口银行在业务范围内加大对集成电路企业服务力度，鼓励和引导国家开发银行及商业银行继续加大对集成电路产业的信贷支持力度，创新符合集成电路产业需求特点的信贷产品和业务。支持集成电路企业在境内外上市融资、发行各类债务融资工具以及依托全国中小企业股份转让系统加快发展。鼓励发展贷款保证保险和信用保险业务，探索开发适合集成电路产业发展的保险产品和服务。
（四）落实税收支持政策。进一步加大力度贯彻落实《国务院关于印发鼓励软件产业和集成电路产业发展若干政策的通知》（国发〔2000〕18号）和《国务院关于印发进一步鼓励软件产业和集成电路产业发展若干政策的通知》（国发〔2011〕4号），加快制定和完善相关实施细则和配套措施，保持政策稳定性，落实集成电路封装、测试、专用材料和设备企业所得税优惠政策。落实并完善支持集成电路企业兼并重组的企业所得税、增值税、营业税等税收政策。对符合条件的集成电路重大技术装备和产品关键零部件及原材料继续实施进口免税政策，以及有关科技重大专项所需国内不能生产的关键设备、零部件、原材料进口免税政策，适时调整免税进口商品清单或目录。
（五）加强安全可靠软硬件的推广应用。组织实施安全可靠关键软硬件应用推广计划，以重点突破、分业部署、分步实施为原则，推广使用技术先进、安全可靠的集成电路、基础软件及整机系统。国家扩大内需的各项惠民工程和财政资金支持的重大信息化项目的政府采购部分，应当采购基于安全可靠软硬件的产品。鼓励基础电信和互联网企业采购基于安全可靠软硬件的整机和系统。充分利用扩大信息消费的政策措施，推动基于安全可靠软硬件的各类终端开发应用。面向移动互联网、云计算、物联网、大数据等新兴应用领域，加快构建标准体系，支撑安全可靠软硬件开发与应用。
（六）强化企业创新能力建设。推动形成产业链上下游协同创新体系，支持产业联盟发展。鼓励企业成立集成电路技术研究机构，联合科研院所、高校开展竞争前共性关键技术研发，引进海外高层次人才，增强产业可持续发展能力。加强集成电路知识产权的运用和保护，建立国家重大项目知识产权风险管理体系，引导建立知识产权战略联盟，积极探索与知识产权相关的直接融资方式和资产管理制度。在集成电路重大创新领域加快形成标准，充分发挥技术标准的作用。
（七）加大人才培养和引进力度。建立健全集成电路人才培养体系，支持微电子学科发展，通过高校与集成电路企业联合培养人才等方式，加快建设和发展示范性微电子学院和微电子职业培训机构。依托专业技术人才知识更新工程广泛开展继续教育活动，采取多种形式大力培养培训集成电路领域高层次、急需紧缺和骨干专业技术人才。有针对性地开展出国（境）培训项目，推动国家软件与集成电路人才国际培训基地建设。通过现有渠道加强对软件和集成电路人才引进的经费保障。在“千人计划”中进一步加大对引进集成电路领域优秀人才的支持力度，研究出台针对优秀企业家和高素质技术、管理团队的优先引进政策。支持集成电路企业加强与境外研发机构的合作。完善鼓励创新创造的分配激励机制，落实科技人员科研成果转化的股权、期权激励和奖励等收益分配政策。
（八）继续扩大对外开放。进一步优化环境，大力吸引国（境）外资金、技术和人才，鼓励国际集成电路企业在国内建设研发、生产和运营中心。鼓励境内集成电路企业扩大国际合作，整合国际资源，拓展国际市场。发挥两岸经济合作机制作用，鼓励两岸集成电路企业加强技术和产业合作。
Translated by Google
By the State Council, now the "National Integrated Circuit Industry Development to promote Outline" published as follows:
IC industry to promote the development of the National Platform
IC industry is the core of the information technology industry, is to support the economic and social development and the protection of national security, strategic, fundamental and leading industry, current and future period is an important period of strategic opportunities and tackling China's industrial development of integrated circuits, to accelerate the development of China's IC industry, formulated outline.
First, the status and situation
In recent years, market driven and policy support, the rapid development of China's IC industry, the overall strength significantly improved, integrated circuit design and manufacturing capabilities with the international advanced level in the gap continued to narrow, packaging and testing technology gradually close to the international advanced level, some key equipment and materials are using domestic production line, and a number with a certain international competitiveness of key enterprises, industrial clustering effect has become more evident. However, the IC industry still exists chip manufacturing enterprises financing difficulties, continuous innovation capability is weak, industrial development and demand of the market, the industry chain lack of coordination, inadequate policy environment to adapt to industry characteristics and other outstanding issues, the level of industrial development and the advanced countries compared to the (regional) still exists a wide gap between IC products rely heavily on imports, it is difficult to form a strong support to build the core competitiveness of the national industry, information security and so on.
At present, the global IC industry is entering a major adjustment period of change. On the one hand, global market structure to speed up the adjustment of the rapid rise in the scale of investment, market share, competitive enterprises to accelerate the focus. On the other hand, the mobile intelligent terminal and the chip was the explosive growth of cloud computing, networking, big data and other new formats rapid development, the emergence of new trends in the evolution of integrated circuit technology; China has the world's largest integrated market, the market demand will continue to maintain rapid growth. Under the new situation, China's IC industry is facing both huge challenges, but also ushered in a rare opportunity, should give full play to market advantages, to create a good environment for development, stimulate business vitality and creativity, promote the sustainable development of the industrial chain collaboration, accelerate the catch-up and beyond the pace of efforts to achieve the integrated circuit industry by leaps and bounds.
Second, the general requirements
(A) guidelines.
Deng Xiaoping Theory, the important thought of "Three Represents", the scientific concept of development as guidance, thoroughly study and understand the party's 18 and the eighth session of the Second, the Third Plenum of the spirit, the implementation of the decisions and arrangements of the CPC Central Committee and the State Council, make the market play a decisive role in the allocation of resources, better play the role of government, prominent corporate body status, demand-oriented, machine and systems for traction, designed as the leading manufacturer of infrastructure, equipment and materials for the support, technology innovation model innovation and institutional innovation as the driving force to break the bottleneck of industrial development, promoting the integrated circuit industry breakthroughs in key areas and the overall improvement, to achieve leapfrog development, economic development pattern, and national security, to provide strong support to enhance the comprehensive national strength.
(B) basic principles.
Demand traction. Relying on market advantage, for the towers, the whole focus of consumer demand, and information to enhance their market adaptability and effective supply levels, build a "chip - Software - machine - system - information services" industry chain.
Innovation-driven. Strengthen the dominant position of enterprise technology innovation, research and development efforts, combined with the national implementation of major projects technological breakthroughs in key technologies integrated, collaborative mechanism for promoting innovation and business model innovation.
Flex. Strengthen integrated circuit design and software development collaborative innovation to improve hardware performance driven software development, to promote the optimization and upgrading of software and hardware technology advancement and the level of IT industry as a whole improved.
Major breakthroughs. Strengthen the combination of market demand and technology development to achieve national security and market potential, the rapid development of a good industrial base in key areas.
Open development. Make full use of global resources, promote the industry chain of open innovation and development, strengthen international exchanges and cooperation, to enhance competition in the global industry's position and influence.
(C) development goals.
By 2015, the IC industry development mechanism innovation system achieved significant results, the establishment of law and industrial development financing platform compatible and policy environment. IC industry sales revenue over 350 billion yuan. Mobile intelligent terminals, network communication and some other key areas of IC design technology closer to world-class level. 32/28 nanometer (nm) manufacturing process to achieve the scale of production, sales of high-end packaging and testing the proportion of total income packaging and testing industry reached more than 30%, 65-45nm key equipment and 12-inch silicon wafers and other key materials to be applied in the production line .
To 2020, the gap between the integrated circuit industry and the international advanced level and gradually narrow, industry-wide annual sales growth rate of over 20%, significantly enhanced capacity for sustainable development of enterprises. Key areas of mobile intelligent terminals, network communications, cloud computing, networking, data and other large integrated circuit design technology has reached the international advanced level, the initial formation of the industrial ecosystem. 16 / 14nm manufacturing process to achieve the scale of production, packaging and testing technology has reached the international advanced level, key equipment and materials into the international procurement system, basically completed technologically advanced, safe and reliable integrated industrial system.
By 2030, the main part of the integrated circuit industry chain to reach the international advanced level, a number of enterprises to enter the international first-tier, to achieve leapfrog development.
Third, the main tasks and development priorities
(A) focus on the development of IC design industry. Focusing on key areas of the industry chain, strengthen integrated circuit design, software development, system integration, content and services collaborative innovation, driven by the rapid growth of the design development of manufacturing industry. Recent focus mobile intelligent terminal and network communications, the development of large surface wide mobile intelligent terminal chips, digital TV chips, network communications chips, smart wearable device chip and the operating system upgrade IT industry's overall competitiveness. Role of market mechanism to guide and promote the integrated circuit design enterprises mergers and acquisitions. Accelerate cloud computing, networking, emerging field of big data and other core technology research and development based on the new formats, new applications of information processing, sensors, new memory chips and other key cloud operating system and other infrastructure software, to seize the high ground of the future industrial development. Sub-domains, sub-categories and gradually break through smart cards, smart grid, intelligent transportation, satellite navigation, industrial control, financial electronics, automotive electronics, medical electronics, and other key integrated circuits and embedded software, to improve the depth of integration of information technology and industrialization support capabilities.
(Ii) accelerate the development of integrated circuit manufacturing. Seize the favorable opportunity of technological change, breaking the bottleneck of investment and financing, continue to promote the construction of advanced production lines. Accelerate the 45 / 40nm chip production capacity expansion, intensified 32 / 28nm chip production line construction, the rapid scale production capacity. Accelerate the development of three-dimensional technology to promote 22 / 20nm, 16 / 14nm chip production line construction. To develop simulation and mixed-signal circuits, micro-electromechanical systems (MEMS), high-voltage circuits, RF circuits and other features dedicated production lines. Enhanced integrated chip manufacturing capacity to drive the design process of capacity building to enhance the level, in order to promote the production line supporting the development of key equipment and materials.
(C) enhance the level of advanced packaging and testing industry. Vigorously promote domestic packaging and testing corporate mergers and acquisitions, increased industrial concentration. Upgrade to adapt to the evolution of demand for integrated circuit design and manufacturing process node, to carry out the chip scale package (CSP), wafer-level packaging (WLP), silicon vias (TSV), three-dimensional package and other advanced packaging and testing technology development and industrialization.
(D) breakthrough IC key equipment and materials. Strengthen integrated circuit equipment, materials and technology combined R & D lithography, etching machine, ion implantation and other key equipment, the development of the photoresist, the large size wafers and other key materials to enhance IC manufacturers and equipment, materials companies collaboration, accelerate the industrialization process, and enhance industrial supporting capacity.
Fourth, safeguard measures
(A) to strengthen the organization and leadership. Establishment of the National Integrated Circuit Industry Development Leading Group, responsible for the development of the integrated circuit industry to promote the co-ordination work, strengthen top-level design, integration mobilize resources to solve major problems. The establishment of the Advisory Committee on major issues and industrial development policies and measures to conduct research, demonstration and assessment conducted to provide advice.
(B) the establishment of a national industrial investment fund. National Industry Investment Fund (hereinafter referred to as the Fund) is mainly to attract large enterprises, financial institutions and social capital, focusing on the development of integrated circuits and other industries, promote industrial restructuring and upgrading. Fund the implementation of market-oriented operation, focusing on the manufacture of integrated circuits, taking into account the design, packaging and testing, equipment, and materials sectors, encourage enterprises to improve productivity levels and the implementation of mergers and acquisitions, corporate governance norms, forming a virtuous self-development. Support the establishment of local IC industry investment fund. Encourage all types of venture capital and equity investment funds into integrated circuits.
(C) increase financial support. Actively play complementary strengths policy and commercial finance, and support China Exim Bank to increase the intensity of services integrated enterprise within the business scope, encourage and guide the State Development Bank and commercial banks continued to increase credit support to the integrated circuit industry innovation in line with the demand characteristics of the integrated circuit industry credit products and services. Support IC enterprises listed overseas financing, issuance of various types of debt financing instruments and share transfer system relying on the country to accelerate the development of SMEs. Encourage the development of loan guarantee insurance and credit insurance business, to explore the development of integrated circuits for the industrial development of insurance products and services.
(D) the implementation of tax support policies. Intensify the implementation of the "State Council issued a number of policies to encourage the software industry and integrated circuit industry notice" (Guo Fa [2000] No. 18) and the "State Council issued further encourage the development of software and IC industry notice a number of policy "(Guo Fa [2011] No. 4), to accelerate the development and improvement of relevant implementing rules and supporting measures to maintain political stability, the implementation of an integrated circuit packaging, testing, special materials and equipment preferential corporate income tax. Implement and improve corporate mergers and acquisitions to support integrated corporate income tax, value added tax, business tax policies. Key equipment to meet the requirements of IC products of major technical equipment and key parts and raw materials continue to implement the import tax policy, as well as major projects related to science and technology is not required for domestic production, spare parts, raw materials imported duty-free policy, adjust the duty-free import of goods list or directory.
(V) to strengthen the promotion of safe and reliable hardware and software applications. Organization and implementation of key hardware and software applications secure promotion programs to major breakthroughs, sub-sector deployment, step by step implementation of the principle of promoting the use of advanced technology, safety and reliability of integrated circuits, basic software and machine systems. Government procurement of various parts of the country to expand domestic demand and financial funds to support projects that benefit the major information technology projects should purchase a reliable hardware and software-based security products. Encourage basic telecommunications and Internet companies to purchase hardware and software-based security and reliable machine and systems. Take advantage of the expansion of the information consumer policy measures to promote the safe and reliable hardware and software based on the development and application of various types of terminals. Emerging applications for the mobile Internet, cloud computing, networking, big data, accelerate the construction of the standard system, hardware and software development and application support safe and reliable.
(Vi) strengthening innovation capacity building. Promote the formation of the chain collaborative innovation system and support the development of industry alliances. Encourage enterprises to set up integrated circuit technology research institutions, joint research institutes, colleges and universities to carry out pre-competitive research and development of key technologies in common, the introduction of overseas high-level talents, and enhance capacity for sustainable development of the industry. Strengthen the use and protection of intellectual property ICs, the establishment of national major project risk management system of intellectual property rights, and guide the establishment of a strategic alliance of intellectual property, and actively explore IP-related direct financing and asset management system. Major innovations in the field of IC accelerate the formation of standards, give full play to the role of technical standards.
(Vii) increased personnel training and the introduction of intensity. Establish a sound IC personnel training system, to support the development of microelectronics disciplines, universities and IC enterprises through joint training of personnel, etc., to accelerate the construction and development of exemplary School of Microelectronics and microelectronic vocational training institutions. Relying on professional and technical personnel to update their knowledge engineering extensive continuing education activities take many forms and vigorously develop high-level training in the field of integrated circuits, badly needed and key professional and technical personnel. To carry out targeted abroad (Habitat) training programs to promote national software and IC Talent International Training Bases. Strengthen the software and integrated circuit talent introduction funding secured through existing channels. In the "people plan" to further increase the inflow of talent ICs support to study the introduction of high-quality technology for outstanding entrepreneurs and management teams to introduce preferential policies. Support IC enterprises to strengthen cooperation with overseas research institutions. Allocation to improve incentives to encourage innovation and creativity, scientific research and the implementation of scientific and technical personnel of the shares, options and other incentive and reward income distribution policies.
(Viii) continue to expand outside world. Further optimize the environment, efforts to attract the country (territory) outside the capital, technology and talent, encouraging international IC enterprises in the domestic construction and development, production and operations center. Encourage domestic enterprises to expand international cooperation in the integrated circuit, the integration of international resources, expand the international market. Play a role in cross-strait economic cooperation mechanism to encourage enterprises to strengthen cross-strait integrated circuit technology and industrial cooperation.
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