2013年9月21日

天兔來亂 新竹市鬧區清晰可見大霸尖山


點擊圖片可瀏覽相關圖片
新竹市最熱鬧的民生路往山區看,大霸尖山竟然在你正前方。圖1/2:陳權欣/攝
新頭殼newtalk 2013.09.20 陳權欣/新竹報導
http://newtalk.tw/news/2013/09/20/40326.html

中秋節當天上層雲氣遭天兔外圍環流狂捲,一度使得視線可以遠望。許多新竹市民站於最熱鬧市區的民生路南望竟然可以清楚看到大壩尖山就在你正前方而嘖嘖稱奇,新竹市直線距離大霸尖山大約100公里,如此清楚看到大霸,也難怪身處都市叢林的新竹市民感覺稀奇。

事實上,不止新竹市民生路可以清楚看到大霸,所有新竹市南北向的市區道路,都可看到大霸在你正前方,主要原因是距離夠遠,大霸夠高的原因。

大霸尖山在風水地理上,雖然是新竹的太祖山,但在地理定位上卻隸屬苗栗的泰安鄉,但在新竹采訪冊上記載,大霸尖山還曾分別隸屬新竹、苗栗與彰化所共有,非常有趣。 

海拔3.492 公尺的大霸尖山,在造山運動形成了奇特的互層堆疊山岳景觀,素有世紀奇峰之美譽,一年四季,因時序之更迭風貌各異。直到目前還有很多人以為大霸尖山在新竹縣。 

根據新竹采訪冊中的記載,大霸又稱為熬酒桶山,在新竹縣東南百里之處,其山從淡水縣蕃界中東南方來,在諸山之上突起一峰,頂平而圓,形如熬酒桶而得名。新竹采訪冊又說,風水家稱大霸為「沖天木」是新竹縣市的太祖山。 

但根據彰化縣誌的記載,彰化人稱大霸為大員山,稱此山在彰化縣東北70餘里,山頂圓形似酒桶故俗稱酒桶山;而苗栗縣舉人吳子光又說,此山在苗栗縣境。 

新竹采訪冊的結論說,此山高不可抑,常由新竹行至嘉義縣境沿途猶遠望之,蓋不特為新竹縣之太祖山,其中擘幹分支,亦即台灣(指台中府)、台南諸府之祖山也。

從新竹采訪冊中得知,原來大霸尖山不止在新竹市看得清清楚楚,在彰化、台中天氣好的時候,都看得很清楚,只是平常空氣不佳,被混濁的雲霧遮住而己。

2013年9月20日

釋憲決定 憲法上權力分立以及黨紀是否可以凌駕一切等問題


馬王九月政爭觸動了台灣前所未有的憲政風暴,涉及的是 憲法上權力分立以及黨紀是否可以凌駕一切等問題。
以法律人的角度來看這件事,我們很欣喜地看到王院長循法律途徑救濟,以及李應元委員打算進行釋憲聲請,這代表著國內處理政治問題已從過去赤裸裸地權力鬥爭模式,轉移到現代化的司法解決模式。台灣若能利用此一事件,將憲政制度鞏固起來,則可說是因禍得福。因此,筆者強力支持釋憲聲請案,且筆者認為大法官應就此案特別迅速處理,以期在最短的時間內解決此一糾紛。
由於本案是身為行政權首長之總統企圖迫使代表民意之國會議長下台,若不成功的話,總統應承擔這一切之政治責任,依據責任政治之原理,選擇下台負責,以示總統為其政治理念負責。

侵台颱風強度 近20年來天兔排第2 Super-Typhoon Usagi

侵台颱風強度 近20年來天兔排第2
強颱天兔進逼,中心最大風速每秒55公尺,根據氣象局歷史資料,為20年來多個強颱中並列第二強,但排不上史上前10名。
氣象局颱風資料庫資料顯示,1994年強烈颱風道格近中心最大風速為每秒58公尺、7級風暴風半徑350公里,20年來排名第一強。
20年來颱風併列第二強的還包括1994年的弗雷特、1997年艾文、1998年瑞伯、2005年海棠、2011年桑達、2012年杰拉華,都是強烈颱風,近中心最大風速測得數據都為每秒55公尺。
氣象局氣象預報中心主任鄭明典說,颱風的強度不僅要看近中心最大風速,還要看7級風的暴風半徑大小,要勉強說誰第一強、第二強?這是「認定」的問題。
鄭明典也說,颱風的強度與「聖嬰現象」有關,如果當年是「聖嬰年」,颱風強度就會增加,同一年來襲的颱風強度也會差不多。
根據氣象局颱風資料庫,從1958年開始記錄以來,最強的颱風是1961年的南施,近中心最大風速達每秒100公尺,換算時速為360公里,7級風半徑高達650公里。
氣象局史上第二強的颱風有5個併列,包括1958年的葛瑞絲、1959年瓊安、1962年歐珀、1964年沙莉和1965年瑪麗,近中心最大風速測得值均為每秒75公尺。
【2013/09/20 中央社】http://udn.com/


全文網址: 侵台颱風強度 近20年來天兔排第2 | 強颱天兔撲台 | 國內要聞 | 聯合新聞網 http://udn.com/NEWS/NATIONAL/NATS2/8174522.shtml#ixzz2fPJCuVOq
Power By udn.com 



衛星雲圖衛星雲圖




衛星雲圖

CNN:今年最強颱風! 天兔增強為「魔鬼兔」

國際中心/綜合報導
強颱天兔持續近逼,中央氣象局已在今(20)日上午8時30分發布天兔海上陸上颱風警報。根據美國有線電視(CNN)形容,天兔結構紮實、完整,已經是隻「超級颱風」,且威力已經增強為「魔鬼兔」!
美國有線電視(CNN)引述美國太空總署(NASA)資料表示,超級颱風天兔的暴風圈直徑已經超過1千公里,結構相當紮實、完整,將是今年(2013)以來最強的颱風。
此外,日本氣象廳的報告也指出,天兔已經增強為「猛烈級」大型颱風,且來勢洶洶。日本氣象廳指出,目前「超級颱風」天兔正朝著西北西風向直撲台灣。





太驚人!竹縣4小時閃電破百次

 中國時報 /竹縣報導 



新竹縣18日晚間出現逾百次閃電,持續近4小時,閃電範圍距平地不遠,就連市區民眾都可清楚看見。(網友ChaosKim Tseng提供)




新竹縣18日晚間出現逾百次閃電,持續近4小時,閃電範圍距平地不遠,就連市區民眾都可清楚看見。(網友ChaosKim Tseng提供)

中秋皎潔明亮的月色,18日晚間卻被逾百次閃電畫破寧靜,新竹氣象站指出,對流堆積產生放電作用,北部、東北部都有頻繁閃電情形。前晚不少民眾賞月烤肉時,被雷電大作的駭人場面嚇到,直呼「真掃興」,不過也有網友把握機會將市區閃電的場景拍下。
新竹縣晚上出現頻繁閃電,持續近4小時,因閃電範圍距平地不遠,就連市區民眾都可清楚看見,不過卻是「只見閃電、未聞雷聲」,網友戲稱,皎潔的月色被大量烏雲淹沒,反而是每3到5分鐘就畫破夜空的閃電,成為最搶戲的「攪局者」。
新竹氣象站主任李秀蓮指出,隨著天兔颱風逐漸逼近台灣,產生氣流,昨晚大量對流堆積,從傍晚6時15分到9點50分,在近新竹山區產生放電、雷擊情況,東北部和北部山區也有出現類似情形。
有網友推算,前晚總共出現超過百次閃電,相當地罕見,拍下數條閃電同時畫破竹北夜空的曾姓網友表示,他在文平路高樓上朝東南方拍,目睹數次如密網般的閃電降在山區,「真是太驚人了」。

Hong Kong braced for 'strongest storm on earth' as 180mph monster Super-Typhoon Usagi gains strength over the Pacific

The storm is set to roar between the Philippines and Taiwan before hammering the southern Chinese coast




A monster Super Typhoon has intensified explosively in the last 24 hours and remains on track to wreak havoc in Taiwan, the Philippines and potentially Hong Kong over the weekend.

Over the last day Super Typhoon Usagi, which is now the strongest storm to form on earth this year, has seen winds increase from 75mph on Tuesday to over 160 mph today. The cyclone is now classified now as a Super Typhoon and is considered the equivalent of a category 5 hurricane.
The storm, which is expected to maintain its current strength for at least the next 24 hours, is on course to dump 1000mm of rain (three times the annual London rainfall) on Taiwan over the next three days. The storm is set to roar between the Philippines and Taiwan before hammering the southern Chinese coast, and possibly Hong Kong, later in the weekend.
Experts have said that due to the lack of 'hurricane hunter' aircraft in the Pacific they can't accurately measure how strong the storm is, and that it may be even stronger.
According to Quartz one satellite-based estimate ranks the storm as the most powerful on the planet since 1984, having a minimum central pressure of 882 millibars.
Typhoon Usagi will first batter coastal Taiwan bringing with it damaging winds, a significant storm surge and heavy and persistent rain, before heading towards Hong Kong.
Peak winds are at that time predicted to have weakened to around 100mph.
The storm is currently estimated to be creating waves as high as about 15 meters (50 feet) as it passes through the Luzon Strait which separates Taiwan and the Philippines.
Usagi is a very large tropical typhoon with a diameter of 1,100 kilometers (680 miles). Its outer rain bands were extending across the main northern Philippine island of Luzon and southern Taiwan and strong winds outward up to 220 kilometers (135 miles).
It is packing the 24-hour rainfall accumulation of 500 millimeters (nearly 20 inches) near the center of the typhoon. Philippine weather bureau forecaster Alvin Pura said that the typhoon had gathered strength and speed with gusts of 240 kph (150 mph).
The Batanes Islands, population 16,000, were placed under the highest storm alert, while lower warnings were raised in at least 15 northern provinces where officials warned of flash floods, landslides and storm surges.

2013年9月19日

TSMC Releases 16nm FinFET Design Flows 9/17/2013

TSMC Releases 16nm FinFET Design Flows



Leading pure-play foundry Taiwan Semiconductor Manufacturing Co. Ltd. has announced the existence of three reference design flows for FinFET and 3D-stacked ICs that have been taken to silicon. The silicon validation of these flows signifies the opening up of the manufacturing processes for the design of production volume chips.
Intel was the pioneer of the FinFET in commercial production and remains the only company with such a manufacturing process. However, TSMC is reported to have signed to supply Apple with processors on a three-year contract that will include some FinFET production (see TSMC signs up Apple for three-year FinFET deal).
The three TSMC design flows are: a digital design flow for TSMC's 16FinFET process; a custom design flow for 16FinFET that offers transistor-level design of analog, digital, mixed-signal, custom digital and memory; and a 3D-IC flow for the design of vertically stacked structures and multi-die assemblies.
EDA software vendors collaborated with TSMC to develop and validate these design routes using silicon test vehicles, TSMC said in a press release. However, TSMC did not indicate which companies' tools had been proved effective at which stages of the design process.
The 16FinFET digital design flow uses the Cortex-A15 multicore processor, licensed from ARM Holdings plc, as its validation vehicle for certification. It helps designers adopt the FinFET by addressing such issues as RC modeling, power-performance-area trade-offs, low-vdd operation, electromigration, and power management.
Integrating multiple components in a single stacked component can provide benefits in terms of physical scaling and power consumption. TSMC's 3D-IC design flow addresses such items as through-transistor-stacking (TTS) technology; through silicon vias (TSVs) plus microbumps, back-side metal routing; and TSV-to-TSV coupling extraction.
"These reference flows give designers immediate access to TSMC's 16FinFET technology and pave the way to 3D-IC Through-Transistor-Stacking (TTS) technology," said Cliff Hou, vice president of R&D at TSMC.




TSMC and OIP Ecosystem Partners Deliver 16FinFET and 3D IC Reference Flows http://www.tsmc.com
Issued by: TSMC
Issued on: 2013/09/17
Hsinchu, Taiwan, R.O.C. – Sept. 17, 2013 – TSMC (TWSE: 2330, NYSE: TSM) today released three silicon-validated Reference Flows within the Open Innovation Platform® (OIP) that enable 16FinFET systems-on-chip (SoC) designs and 3D chip stacking packages. Leading Electronic Design Automation (EDA) vendors collaborated with TSMC to develop and validate all these flows through multiple silicon test vehicles.The new Reference Flows are: 1. TSMC’s 16FinFET Digital Reference Flow, providing comprehensive technology support to address post-planar design challenges including extraction, quantized pitch placement, low-vdd operation, electromigration, and power management. 2. The 16FinFET Custom Design Reference Flow, offering full custom transistor-level design and verification including analog, mixed-signal, custom digital and memory. 3. The 3D IC Reference Flow, addressing emerging vertical integration challenges with true 3D stacking.
“These Reference Flows give designers immediate access to TSMC’s 16FinFET technology and pave the way to 3D IC Through-Transistor-Stacking (TTS) technology,” said TSMC Vice President of R&D, Dr. Cliff Hou. “Delivering our most advanced silicon and manufacturing technologies as early and completely as possible to our customers is a major milestone for TSMC and its OIP design ecosystem partners.”
16FinFET Digital Reference Flow
The 16FinFET Digital Reference Flow uses the ARM Cortex™-A15 multicore processor as a validation vehicle for certification. It helps designers adopt the new technology by addressing FinFET structure related challenges of complex 3D Resistance Capacitance (RC) modeling and quantized device width. In addition, the flow provides methodologies for boosting power, performance and area (PPA) in 16nm, including low-voltage operation analysis, high-resistance layer routing optimization for interconnect resistance minimization, Path-Based Analysis and Graph-Based Analysis correlation to improve timing closure in Automatic Place and Route (APR).
16FinFET Custom Design Reference Flow
The 16FinFET Custom Design Reference Flow enables custom design by addressing the growing complexity of 16FinFET process effects and provides methodologies for design compliance in 16nm manufacturing and reliability.
3D IC Reference Flow
The 3D IC process produces significant silicon scaling, power and performance benefits by integrating multiple components on a single device. TSMC’s 3D IC Reference Flow addresses emerging integration challenges through 3D stacking. Key features include Through-Transistor-Stacking (TTS) technology; Through Silicon Via (TSV)/microbump and back-side metal routing; TSV-to-TSV coupling extraction.
About Open Innovation Platform
OIP promotes innovation for the semiconductor design community and ecosystem partners based on TSMC’s complete technology portfolio. OIP includes a set of ecosystem interfaces and collaborative components initiated and supported by TSMC that efficiently empower innovation throughout the supply chain, enabling the sharing of newly created revenue and profitability. OIP initiatives include reference flows, third-party IP validation, TSMC library IP, design kits and an online design portal.
About TSMC
TSMC is the world’s largest dedicated semiconductor foundry, providing the industry’s leading process technology and the foundry segment’s largest portfolio of process-proven libraries, IPs, design tools and reference flows. The Company’s owned capacity in 2013 is expected to be about 16.5 million (8-inch equivalent) wafers, including capacity from three advanced 12-inch GIGAFAB™ facilities, four eight-inch fabs, one six-inch fab, as well as TSMC’s wholly owned subsidiaries, WaferTech and TSMC China. TSMC is the first foundry to provide 28-nanometer production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.



台積公司與開放創新平台設計生態環境夥伴聯手推出16FinFET及三維積體電路參考流程
發佈單位 : 台灣積體電路製造股份有限公司
發佈日期 : 2013/09/17
台積公司今(17)日宣佈,在開放創新平台(Open Innovation Platform®, OIP)架構下成功推出三套全新經過矽晶驗證的參考流程,協助客戶實現16FinFET系統單晶片(SoC)與三維晶片堆疊封裝設計,電子設計自動化領導廠商與台積公司已透過多種晶片測試載具合作開發並完成這些參考流程的驗證。台積公司全新的參考流程如下:(一)16FinFET數位參考流程提供完整的技術支援協助解決後平面式(Post-Planar)晶片設計的挑戰,包括粹取(Extraction)、量化線距佈局(Quantized Pitch Placement)、低VDD電壓操作、電遷移、以及電源管理;(二)16FinFET客製化設計參考流程提供包括類比、混合信號、客製化數位與記憶體等電晶體級客製化設計與驗證;(三)三維積體電路(3D IC)參考流程能夠克服以三維堆疊方式進行垂直整合時所帶來的新挑戰。
台積公司研究發展副總經理侯永清博士表示:「這些參考流程讓設計人員能夠立即採用台積公司的16FinFET製程技術進行設計,並且為發展穿透電晶體堆疊(Through Transistor Stacking, TTS)技術的三維積體電路鋪路。對於台積公司及其開放創新平台設計生態環境夥伴而言,及早並完整地提供客戶先進的矽晶片與生產技術著實是一項重大的里程碑。」
16FinFET數位參考流程
16FinFET數位參考流程使用ARM CortexTM-A15多核心處理器做為驗證載具,協助設計人員採用此項新技術克服與FinFET結構相關的挑戰,包括複雜的三維電阻電容模型(3D RC Modeling)與量化元件寬度(Quantized Device Width)。此參考流程亦提供改善16奈米製程功耗、效能與面積的方法,包括低電壓操作分析、高電阻層繞線最佳化以便將電路電阻降到最低、以及針對以路徑與繪圖為基礎的分析(Path-Based Analysis and Graphic-Based Analysis)進行比對以改善自動佈局繞線(Automatic Place and Route, APR)的時序收斂(Timing Closure)。
16FinFET客製化設計參考流程
16FinFET客製化設計參考流程藉由解決在16FinFET製程下複雜度提升的挑戰來協助客戶實現客製化設計,並提供符合16奈米製造及可靠性之設計法則。
三維積體電路參考流程
三維積體電路製程藉由整合多個晶片於同一系統上以顯著提升在尺寸微縮、功耗與效能方面的優勢,台積公司提供的三維積體電路參考流程能夠解決以三維堆疊方式進行垂直整合時所帶來的新挑戰,其主要特性包括穿透電晶體堆疊技術、矽穿孔(Through Silicon Via, TSV)/微凸塊及背面金屬繞線(Microbump and Back-side Metal Routing)、以及矽穿孔對矽穿孔耦合粹取(TSV-to-TSV Coupling Extraction)。
關於開放創新平台
OIP係在晶片設計產業、台積公司設計生態系統合作夥伴以及台積公司的矽智財、晶片設計與可製造性設計服務、製程技術以及後段封裝測試服務之間加速即時創新。它擁有多個互通的設計生態系統介面以及由台積公司與合作夥伴協同開發出的構成要素,這些構成要素係由台積公司主動發起或提供支援。透過這些介面以及基本元件,可以更有效率地加速整個半導體產業供應鏈每個環節的創新,並促使整個產業得以創造及分享更多的價值。開放創新平台的成果包括參考流程、第三方矽智財驗證、台積公司元件庫矽智財、設計套件、以及線上設計入口網站。
關於台積公司
台積公司 (TSMC) 是全球最大的專業積體電路製造服務公司,提供業界卓越的製程技術、元件資料庫、設計參考流程及其他先進的晶圓製造服務。台積公司預計2013年將擁有足以生產相當於1,650萬片八吋晶圓的產能,其中包括三座先進的GIGAFAB™ 十二吋晶圓廠 (晶圓十二廠、晶圓十四廠及晶圓十五廠)、四座八吋晶圓廠 (晶圓三、五、六及八廠)、一座六吋晶圓廠(晶圓二廠)。此外,台積公司亦有來自其轉投資子公司美國WaferTech公司以及台積電(中國)有限公司充沛的產能支持。台積公司係首家使用28奈米製程技術為客戶成功試產晶片的專業積體電路服務公司。其企業總部位於臺灣新竹。進一步資訊請至台積公司網站www.tsmc.com.tw查詢。

2013年9月7日

Sell out of China Construction Bank (BOA , Goldman Sachs) 繼高盛後 美銀悉數出脫建設銀行持股

Bank of America to sell out of China Construction Bank

Date

Bank of America said overnight it started selling its remaining stake in China Construction Bank (CCB) for as much as $US1.5 billion ($1.6 billion), marking the final step of the US bank's multi-year exit from the asset.
The Charlotte, North Carolina-based bank joins a list of Western financial institutions that have found that their investments in Chinese financial firms did not give them the foothold they had hoped for in that country.
"The only thing that will be central to banking in China will be China's domestic banks," said Donald Straszheim, head of China research at International Strategy & Investment in Los Angeles.
Earlier this year, Goldman Sachs sold out of its seven-year investment from Industrial and Commercial Bank of China.
The Chinese banking system has shown signs of stress, with bad loans picking up as economic growth slows. As a result, several Chinese lenders are preparing to launch equity sales to bolster their capital base.
But even before the Chinese banking sector weakened, many US and European banks decided to sell the assets to bolster their capital bases and focus on their main businesses.
Since US and European banks began building stakes in Chinese banks, new international capital rules have been formulated, which will make it more expensive for them to own shares of other financial institutions.
Bank of America said on Tuesday that it expects to record about a $US750 million gain, before taxes, on the stake sale. With that profit, its total gains from dividends and selling shares will amount to nearly $US18 billion before taxes, according to regulatory filings between 2009 and 2013.
The bank's investment dates to 2005 when it paid $US3 billion for a 9.9 per cent stake ahead of the Chinese bank's initial public offering.
At the time, Bank of America's then chief executive Kenneth Lewis said the partnership was designed to give Bank of America more access to roughly 1.3 billion Chinese consumers, while CCB would benefit from BofA's US retail banking experience.
The US bank increased its holdings in following years, before paring it down starting in 2009. In 2011, the bank raised a combined $US14.9 billion from selling shares in CCB to a group of investors that included Singapore's Temasek Holdings .
Bank of America launched Tuesday's sale after a lock-up on its remaining stake expired last month. The bank will continue its strategic partnership with CCB in business areas like customer service and sales models, the bank said in a press release.
The bank launched the offer on Tuesday for 2 billion Hong Kong-traded shares of CCB in a range of HK$US5.63 to HK$US5.81 ($US0.73 to $US0.75) each, according to a term sheet reviewed by Reuters. The price is equivalent to a discount of up to 5.1 per cent to Tuesday's close of HK$US5.93.
Bank of America shares closed at $US14.25, up nearly 1 per cent from Friday's close.
CCB shares are down 4.7 per cent since the beginning of the year in Hong Kong, outperforming the 9 per cent decline in the financial sub-index of the Hong Kong stock exchange in 2013.
Cleaning up
Bank of America has been cleaning up its balance sheet since the financial crisis. In the bank's 2012 annual report, chief executive Brian Moynihan wrote that the bank had divested more than $US60 billion of assets outside its main businesses while improving capital ratios and maintaining its earnings power.
The Charlotte, North Carolina-based bank increased its second-quarter profit 70 per cent to $US3.57 billion. The bank managed to trim operating expenses by 6 per cent while boosting its Basel III capital ratio.
The bank has been particularly active in streamlining its international operations. In recent years Bank of America sold its foreign wealth management businesses to Julius Baer Group and credit card portfolios in Canada, Spain and Britain to various banks and private-equity firms.
Some foreign banks continue to hold on to their investments in Chinese lenders. Among them are HSBC, which owns a 19.9 per cent holding in China's Bank of Communications and Spain's BBVA's has a 15 per cent stake in China Citic Bank.
Reuters


鉅亨網編譯呂燕智 綜合外電  2013-09-04 12:30:28
《路透社》報導,美國銀行(Bank of America)(BAC-US)周二(3日)表示,計畫以至多 15 億美元,悉數出售所餘中國建設銀行(601939-CN)(00939-HK)股權。
這象徵著過去 8 年美銀對建設銀行的投資,完全告一段落。
美銀預計以5.63 - 5.81 港元(約73-75美分)出售 20 億股建設銀行H股;周三台北時間上午 11︰05,建設銀行香港掛牌股價挫低 2.19%,暫報 5.8 港元。
美銀周二股價小漲 0.92%,收 14.25 美元。
美國銀行早在建設銀行 2005年赴香港掛牌前,就斥資 30 億美元收購後者 9.9% 股權;而從 2011 年 8 月開始陸續進行出售,截至今日持有股權已降至 1%。
計錄顯示,光是美銀 2011 年將 5% 左右建設銀行股權售予新加坡淡馬錫(Temasek Holdings),前者就輕鬆入袋了 149 億美元。
與此同時分析師指出,此舉也顯示美國金融業者對中國銀行的投資興趣,已經較前幾年大幅消退。
投資機構 International Strategy & Investment Group 首席研究員 Donald Straszheim 表示,「中國銀行業的核心要角,最終還是中國本土銀行」,而且目前中國銀行體系正面臨經濟降溫,以及壞帳飆高的嚴峻考驗。
今年 5 月高盛(Goldman Sachs)(GS-US) 全數出脫中國工商銀行(1398-HK)(601398-CN)股份,價值約 11.2 億美元,同時也結束了對中國最大銀行長達 7 年的投資。

Torrential rain claims lives in northern provinces 越南北部爆發洪災

Torrential rain claims lives in northern provinces
06/09/2013 | 11:26:08 
http://en.vietnamplus.vn/Home/Torrential-rain-claims-lives-in-northern-provinces/20139/38553.vnplus
Tens of people in the northern mountainous province of Lao Cai were hit by landslides on September 5, resulting from days of torrential rain. 

Twelve people were wounded after being partially buried when they were illegally exploiting gold near a mountain in Minh Luong commune, Van Ban district. 

On the same day, the office of the district’s Tham Duong communal People’s Committee collapsed due to another landslide. No deaths were reported. 

Heavy downpours over the last few days have caused serious floods in the province, killing four, injuring 11 and leaving ten missing. 

According to preliminary statistics, in total there have been 11 dealths, serious road-blockages, destroyed houses and flooded rice fields in four northern provinces of Thai Nguyen, Ha Giang, Lang Son and Lao Cai. 

In response to the tragedy, Prime Minister Nguyen Tan Dung has issued instruction for northern localities to closely monitor the situation and be proactive in evacuating residents living near flood-affected areas. 

Local authorities have also been urged to assist residents in any way they can so that they can resume their normal lives without delay. 

The PM also ordered relevant ministries and agencies to protect embankments, hydropower plants and electricity lines as well as ensure food supply to cope with the aftermath of the floods.-VNA

Vietnam flood toll hits 21

  • photo_1378445628546-1-HD.jpg
    This photo, taken by the Vietnam News Agency on September 5, 2013, shows soldiers pulling out a motorcycle from debris at the scene of flash floods in Sapa district, northern province of Lao Cai. At least 21 people have been killed as flash floods and landslides ravaged mountainous areas in northern Vietnam. (Vietnam News Agency/AFP)
At least 21 people have been killed as flash floods and landslides ravaged mountainous areas in northern Vietnam, disaster officials said on Friday.
About 37 houses have been destroyed along with more than 1,700 hectares (4,200 acres) of crops, the flood and storm control department said.
In the northwestern province of Lao Cai, nine people -- including a three-year-old boy -- died when flash floods sent rocks and soil crashing into a rural village, official media reported.
Authorities are searching for two other people still missing after the incident in the Sapa region, which is popular with tourists, although no foreigners are believed to have been affected.
More than 260 deaths from floods were reported in Vietnam last year


Read more: http://www.foxnews.com/world/2013/09/06/vietnam-flood-toll-hits-21/#ixzz2eALNNHSI



北京新浪網 (2013-09-06 10:10)
越南北部爆發洪災
  國際在線消息:據新華社電,越南防洪抗風中央委員會5日說,越南北部近兩天的暴雨引發洪水和山體滑坡,已導致至少11人死亡,約20人失蹤。
  受4日傍晚強降雨的影響,老街省一初中學校教師宿舍被洪水衝垮,截至5日中午找到7名遇難者的遺體,仍有約20人失蹤。3日晚至4日早晨,萊州省一些地方大雨或特大暴雨引發的山洪和山體滑坡導致3人死亡。河江省有1人在這兩天的暴雨中死亡。高平省也遭到強降雨襲擊,出現山體滑坡等自然災害。
  越南防洪抗風中央委員會5日警告說,未來幾天越南北部將持續降暴雨,有關機構迅速應對災害,幫助當地居民穩定生活


越北暴雨 災情嚴重

(中央社河內6日電)越南北部地區近日連降暴雨,造成嚴重水患與土石坍方等事故,目前已知10多人死亡與失蹤,另外多人受傷,許多山區道路坍方,交通受到嚴重影響。

綜合越南媒體今天報導,老街省(Lao Cai)沙壩縣(Sa Pa)近日連續降下傾盆大雨,引發山洪,沖毀當地1所國中學校教師宿舍,造成7人死亡、4人失蹤、11人受傷。

老街省文盤縣(Van Ban)昨天發生山坡地滑動,造成12人受傷,主因是當地民眾非法開採金礦,造成土石鬆動,加上近日連降暴雨,引發坡地坍方。

在河江省(Ha Giang),2間房舍遭狂風暴雨襲擊倒塌,造成1死2傷。萊州省(Lai Chau)也發生暴雨,許多房舍被洪水沖垮,造成3死1傷。而在太原省(ThaiNguyen),昨天發生兩起嚴重土石坍方事故,造成3人死亡。

據報導,越南北部各地方正在全力救援災民,但因多處山路坍方,地形複雜危險,雨勢未減,救災行動舉步維艱。氣象預報指出,未來幾天,暴雨還會持續,呼籲民眾提高警覺,加緊防洪。



Vietnam
Floods, landslides blight northern Vietnam
Heavy rain causes flooding in the northern mountainous province of Dien Bien (Source: VNA)
​Many provinces in northern Vietnam are suffering from flooding and landslides caused by prolonged heavy rain and are working to deal with the situation. 
​In Lao Cai province, on July 28, a 37-year-old man was swept away by a flood while trying to cross a stream in Liem Phu commune, Van Ban district, according to the local authority. His body was retrieved the same day by local residents.

In Quang Ninh province, prolonged rain for over two days created landslides around the dams in Ha Long city, causing local houses to collapse. As a result, many households had to be urgently evacuated to safer places.

According to the Ha Long city People's Committee, dozens of households were more or less affected by the landslides caused by the heavy rain. Among them, four households were seriously affected and one home completely collapsed.

In Son La province, many roads have been inundated by flooding, causing serious congestion.

One part of the National Highway 6 passing through Chieng Mung commune in Mai Son district, in particular, was completely submerged by water, creating traffic backups of nearly one kilometre that lasted for over two hours.

In response, the local authorities intervened by redirecting traffic along a new route.

Landslides have also blocked the way on three other roads in the province and causing heavy traffic congestion.

Damages from the flood and landslides in Son La are so far unknown, but the crops of many local households were reported to be seriously damaged.

Tuyen Quang province has been also considerably affected by the prolonged heavy rain.

In particular, the rain has broken the dams surrounding the Hoang Tan Reservoir in Ninh Lai commune, Son Duong district, causing damage to dozens of hectares of crops and plants grown by the locals and killing thousands of poultry.

Local authorities in affected provinces are still working to deal with the consequences of flooding and landslide and prevent further damages.


Floods, landslides blight northern Vietnam

Many provinces in northern Vietnam are suffering from flooding and landslides caused by prolonged heavy rain and are working to deal with the situation. 

In Lao Cai province, on July 28, a 37-year-old man was swept away by a flood while trying to cross a stream in Liem Phu commune, Van Ban district, according to the local authority. His body was retrieved the same day by local residents. 

In Quang Ninh province, prolonged rain for over two days created landslides around the dams in Ha Long city, causing local houses to collapse. As a result, many households had to be urgently evacuated to safer places. 

According to the Ha Long city People's Committee, dozens of households were more or less affected by the landslides caused by the heavy rain. Among them, four households were seriously affected and one home completely collapsed. 

In Son La province, many roads have been inundated by flooding, causing serious congestion. 

One part of the National Highway 6 passing through Chieng Mung commune in Mai Son district, in particular, was completely submerged by water, creating traffic backups of nearly one kilometre that lasted for over two hours. 

In response, the local authorities intervened by redirecting traffic along a new route. 

Landslides have also blocked the way on three other roads in the province and causing heavy traffic congestion. 

Damages from the flood and landslides in Son La are so far unknown, but the crops of many local households were reported to be seriously damaged. 

Tuyen Quang province has been also considerably affected by the prolonged heavy rain. 

In particular, the rain has broken the dams surrounding the Hoang Tan Reservoir in Ninh Lai commune, Son Duong district, causing damage to dozens of hectares of crops and plants grown by the locals and killing thousands of poultry. 

Local authorities in affected provinces are still working to deal with the consequences of flooding and landslide and prevent further damages.-VNA

2013年9月3日

不堪連九季虧損 NOKIA(手機) 2千億賣微軟 Microsoft to Buy Nokia Units and Acquire Executive $7.2 billion

不堪連九季虧損 NOKIA 2千億賣微軟


在蘋果和三星等智慧型手機大廠夾殺下,過去全球市佔率超過30%,銷售量第一的手機王NOKIA,已經連續九季虧損,虧損金額高達50億美金,NOKIA終於撐不下去,決定以54.4億歐元,相當於2150億台幣的天價,將手機部門賣給微軟公司,現有的3萬2000名員工,明年起將變成微軟人,這樁交易消息一曝光,NOKIA在芬蘭的股市立刻跳空大漲,漲幅一度超過47%。


Microsoft to Buy Nokia Units and Acquire Executive

SEATTLE — Microsoft said it had reached an 
agreement to acquire the handset and services business of Nokia for about $7.2 billion, in an audacious effort to transform Microsoft’s business for a mobile era that has largely passed it by.

Late Monday, Microsoft and Nokia said 32,000 Nokia employees would join Microsoft as a result of the all-cash deal, which is meant to turn the Finnish mobile phone pioneer into the engine for Microsoft’s mobile efforts.
Stephen Elop, the former Microsoft executive who was running Nokia until the deal was signed, will rejoin Microsoft after the transaction closes, setting him up as a potential successor to Steven A. Ballmer, Microsoft’s chief executive. Mr. Ballmer has said he will retire from the company within 12 months.
“This agreement is really a bold step into the future for Microsoft,” Mr. Ballmer said in a telephone interview from Finland. “We’re excited about the talent capabilities it will bring to Microsoft.”
The deal, which was first broached between Microsoft and Nokia executives in February, is the latest transformation of the 150-year-old Finnish company. Nokia began life as a conglomerate making products like rubber boots and car tires before reinventing itself in the 1980s as the world’s largest manufacturers of cellphones.
Nokia’s once mighty position in the mobile phone business has been lost, as the industry shifted to the era of the smartphone. Samsung and Apple divide nearly all of the profits in the global smartphone business now.
Nokia’s fall has been most spectacular in Asia, a region that its phones once dominated. As recently as 2010, the company had a 64 percent share of the smartphone market in China, according to Canalys, a research firm. By the first half of this year, that had plunged to 1 percent.
While Nokia phones used to be prized in Asia and other developing economies for their durability and value, the company was late to introduce innovations like touch screens. That left the high end of the market to brands like Apple and Samsung.
In the lower price ranges, smartphone makers from China have been more responsive to consumer demands, offering phones with features resembling those of their more expensive rivals at a fraction of the cost.
Risto Siilasmaa, Nokia’s interim chief executive, said on Tuesday that the sale of the handset business was the logical step in the company’s evolution but still pulled on his heartstrings.
“Selling a business is sometimes the right cause of action, but it’s emotionally complicated,” Mr. Siilasmaa said.
Consumers may be less concerned.
At a cellphone store in central London on Tuesday, Geoffrey Widdows, a 33-year-old engineer, said he had once been a devoted Nokia fan but now preferred Android phones because of the greater choice of apps available on phones from companies like Samsung and HTC.
“Everyone had a Nokia when I was growing up,” he said. “You just don’t see them around a lot anymore.”
A megadeal between Nokia and Microsoft is something that pundits and analysts have speculated about for years, after Mr. Elop joined Nokia and signed a pact with Microsoft in February 2011 to standardize the software company’s Windows Phone operating system.
The cellphone fortunes of the two companies have become closely intertwined since that agreement, but the relationship has done little to turn either company into a leader in the mobile business. Handsets running Windows Phone accounted for only 3.7 percent of smartphone shipments in the second quarter, according to the technology research firm IDC.
Nokia remains the second-largest shipper of mobile phones in the world, after Samsung, but that is largely because of lower-end feature phones, from which consumers are moving away. Nokia is no longer among the top five makers of smartphones.
A big question is whether Microsoft and Nokia will succeed as one company where they have not as close partners. Mr. Ballmer said Microsoft and Nokia had not been as agile separately as they would be jointly, citing how development could be slowed down when intellectual property rights were held by two different companies.
“There’s friction,” he said.