2014年10月31日

Japan's MegaChips to Buy MEMS Timing Leader SiTime

Japan's MegaChips to Buy MEMS Timing Leader SiTime

UMC Takes Bigger Slice of 28nm Business

UMC Takes Bigger Slice of 28nm Business

Stands pat on capex 
10/29/2014 04:45 PM EDT 



http://www.eetimes.com/document.asp?doc_id=1324437&_mc=NL_EET_EDT_EET_daily_20141030&cid=NL_EET_EDT_EET_daily_20141030&elq=6e92aedbe1134e9686c9a4b817caee01&elqCampaignId=19922


TAIPEI — UMC, the world’s third-largest chip foundry, said Wednesday, Oct. 29, that it has grabbed a larger piece of the 28 nanometer business that is dominated by Taiwan Semiconductor Manufacturing Company Ltd. (TSMC). UMC reiterated its capital expenditure for this year at about $1.3 billion.

UMC said that 28 nm products accounted for 3% of its foundry revenue during the third quarter this year, up from 1% during the previous quarter. The company expects continuing increases from the process technology during the rest of the year.
“Twenty-eight nanometer revenue will more than double during the fourth quarter compared with the third quarter,” UMC CEO Po-Wen Yen said during a conference call to announce the company’s third-quarter financial results. “We have more than 20 customers engaged, more than 15 in tape-out, and five in production.”
Twenty-eight nanometer has been the sweet spot for foundry leader TSMC for nearly two years, virtually the sole supplier in that technology node to customers such as Qualcomm and Apple in communications products including smartphones and tablets. During the third-quarter this year, 28 nm accounted for 34% of TSMC’s total wafer revenues, while 20 nm reached 9%.
UMC has “turned a corner in volume,” Bank of America Merrill Lynch analyst Daniel Heyler said.
UMC said its 28 nm yield progress for poly-SiON and gate-last, high-K metal gate products has continued to improve, helping to attract new customers and diversify the company’s customer base in advanced nodes.
The company’s 14 nm FinFET process technology is on track and will be available for customer tape-outs during the first half of 2015, CEO Yen said.
No 2015 capex forecast
UMC declined to forecast its capital expenditure for 2015 even as rival TSMC said it would increase spending to more than $10 billion next year. The $1.3 billion UMC earmarked for this year is down from the $1.5 billion the company budgeted for 2013.
Capex in 2015 will be related to cash inflow from operations, UMC CFO Chitung Liu said: “It will depend on the market outlook.”
UMC said its capacity utilization in the fourth quarter this year will drop to about 90% from 93% during the third quarter.
Plans for new China fab
UMC has a joint venture for 12-inch wafer foundry services with the Xiamen Municipal People’s Government and FuJian Electronics and Information Group in China.
Initially, UMC plans to hold a one-third stake in the venture expected to cost a total $6.2 billion, increasing ownership to two-thirds by around 2020 and eventually 100% over a period of up to 10 years, CFO Liu said. UMC’s initial outlay is aimed at reducing the company’s financial burden.
The China venture will use 40-55 nanometer process technology to make chips for customers in such businesses as SIM cards. The process technology used in the joint venture company will meet Taiwan government restrictions, UMC says. Taiwan wants its chipmakers investing in China to use a process that is double the nanometer gate width of state-of-the-art technology. The company declined to say whether the fab would be converted to more advanced technology in the future.
“The Taiwan government doesn’t allow 28 nanometer technology in China yet,” said Liu.
The Taiwan government restricts chip investments by domestic companies in China on concerns it will lose jobs and core technology. UMC currently owns an 87 percent stake in China’s HeJian Technology, which provides eight-inch wafer foundry services.
UMC aims to collaborate with partners in Asia in capacity deployment. The company claims the model will establish manufacturing centers that will serve local markets and help global customers mitigate geographical risks in the supply chain.
UMC’s recent announcement of a partnership with Fujitsu Semiconductor and the joint venture in Xiamen are examples of the company’s collaborative efforts, says UMC. The foundry alliance with Fujitsu includes a 40 nm licensing agreement that UMC hopes will better enable it to serve the Japanese market.
Earnings slump
UMC posted third-quarter net income of NT$2.92 billion (US$96 million), down from the NT$3.48 billion the company reported in the same period a year ago. Profit was dragged down by equipment upgrades at the company’s Singapore fab and a slowdown in UMC’s new solar energy subsidiary.

2014年10月25日

中國國家集成電路推進綱要


2014-07-03 08:31:25來源: 科技日報網絡版作者: 胡唯元我有話說(1人參與)
中國  
《國家集成電路產業發展推進綱要》(以下簡稱《推進綱要》)已經由國務院正式批准發佈實施。魏少軍認為,集成電路企業如果想獲得《推進綱要》的支持,首先應該和國家發展需求緊密結合。
  國家集成電路推進綱要出臺 產業扶持力度前所未有
  欲獲鉅資支持 企業須應對三大考驗
  文·本報記者 胡唯元
集成電路產業迎來了重大利好消息,力度空前的扶持政策正在緩緩拉開帷幕。
  6月24日,工業和信息化部、國家發改委、科技部、財政部在北京發佈消息:《國家集成電路產業發展推進綱要》(以下簡稱《推進綱要》)已經由國務院正式批准發佈實施。
  參與《推進綱要》起草工作的清華大學微電子所所長魏少軍教授日前接受科技日報記者專訪,他表示此次產業扶持政策力度前所未有,在重大發展機遇面前“企業家會有嚴峻考驗”。
  有形之手與無形之手的結合
  魏少軍認為,分析這次《推進綱要》的扶持政策,產業界首先要注意的一點是實施主體的變化。
  “這次發佈的《國家集成電路產業發展推進綱要》,‘綱要’和以往的‘鼓勵政策’相比,是一個很不一樣的說法。”魏少軍說,“鼓勵政策是幫助企業,企業可以要這個幫忙,也可能不要這個幫忙,責任主體在企業。綱要就是政府要做的事情,主體是政府。這是一個非常大的變化。這次,市場這只無形的手,和政府有形的手很好地結合起來。”
  2000年6月,國務院印發《鼓勵軟件產業和集成電路產業發展的若干政策》,即通常所說的18號文件。2011年1月28日國務院印發《國務院關於印發進一步鼓勵軟件產業和集成電路產業發展的若干政策的通知》,也就是4號文件。這兩份文件對於集成電路產業的發展當時都起到了重要的作用。
  但是由於集成電路產業特點和國內外的市場變化,集成電路產業可以說遠遠沒有達到人們的期望值。此次《推進綱要》也談到了當前集成電路產業仍然存在芯片製造企業融資難、持續創新能力薄弱、產業發展與市場需求脫節、產業鏈各環節缺乏協同、適應產業特點的政策環境不完善等突出問題。
  “考慮到我國集成電路產業的現狀,政府這只有形的手出手是必然的,這反映了政府對產業現狀的把控能力和嫻熟的執政能力。”魏少軍說。
  工信部方面在談到此次《推進綱要》的亮點時,首先談到了政府將發揮更大的作用,“加強組織領導,成立國家集成電路產業發展領導小組,強化頂層設計,統籌調動中央、地方及社會各方資源”。
  投資基金一定涉及股權和投資回報
  這一次集成電路產業扶持政策中,最引起產業界關注的是提出設立“國家產業投資基金”。坊間盛傳基金規模將達到千億元以上。
  “綱要提出要建產業基金,注意是投資基金而不是發展基金。”魏少軍說,“以往出臺的政策,要麼是沒有配套資金,要麼是鼓勵發展型的。我鼓勵你發展,給你點補貼,給你點研發支持,但都不涉及股權。但投資基金就不一樣了,它一定是要涉及股權,而且一定要有投資的回報。”
  《推進綱要》提出,“設立國家產業投資基金。國家產業投資基金主要吸引大型企業、金融機構以及社會資金,重點支持集成電路等產業發展,促進工業轉型升級。”
  資本不足是集成電路發展的關鍵難題。我國骨幹企業雖已初步形成一定盈利能力但不鞏固,自我造血機能差,無法通過技術升級和規模擴張實現良性發展(2013年中芯國際盈利已經達到歷史最高水平,約為1.7億美元,但投資一條月產5萬片的12英寸28nm生產線約需50億美元,臺積電2013年凈利潤達62億美元,自有資金就能滿足其年度投資需求一半以上)。同時,國內融資成本高,社會資本也因芯片製造業投入資金額大、回報週期長、短期收益低而缺乏投入意願。
  對於產業投資基金的規模,魏少軍沒有給予正面回應。但他也表示,“集成電路是長期高強度的投入。”
  “集成電路的投入是有講究的。以往的投入由於是屬於政策補貼型,所以不是按照市場規則出牌,投入的力度不大。集成電路的投入,必須投入到預值以上,達不到預值,投入的意義不大,基本上就是浪費。比如投入一兩億美元,我們覺得很大了,但是對製造企業意義不大。它要投入就要幾十億美元。而且,投資要有持續性。” 魏少軍說,“沒有足夠的資本,企業就不可能做大事,也無法做大做強。”
  股權改造可以改變“小散弱”的格局
  《推進綱要》提出,基金實行市場化運作,重點支持集成電路製造領域,兼顧設計、封裝測試、裝備、材料環節,推動企業提升產能水平和實行兼併重組、規範企業治理,形成良性自我發展能力。
  “另一方面,股權的改造其實可以改變現有的發展格局。比如說有的企業具有發展前途,但是它的股權結構在這裡,發展中受到現有股權結構的制約,導致它發展不起來。投資基金進去以後,就可以發生變化。”魏少軍說。
  當前集成電路企業的特點是小散弱,500多家集成電路設計企業收入僅約是美國高通公司的60%—70%。製造企業量產技術落後國際主流兩代,關鍵裝備、材料基本依賴進口。全行業研發投入不足英特爾一家公司的六分之一。
  “我們的企業總的來說比較小,比較散。怎麼通過綱要的實施,來形成一些大企業,這是一個很重要的課題。”魏少軍說。
  企業獲得投資基金支持須有三條件
  空前利好的政策出臺後,集成電路企業如何抓住機遇,獲得政策的優惠?
  “首先我們要問自己一個問題,國家為什麼要做推進綱要?首先是滿足國家的戰略需求。國家戰略發展中所依靠的一些核心的芯片,我們基本上都依賴國外。其次,解決產業發展兩頭在外的現象。也就是說,我們的設計企業,加工在外;製造企業,設計在外。” 魏少軍說。
  魏少軍認為,集成電路企業如果想獲得《推進綱要》的支持,首先應該和國家發展需求緊密結合。
  “如果國家戰略需求的重點芯片還得靠進口,那我們就失敗了。如果你要失敗,那我為什麼把錢投給你?企業必須要明白,必須跟著國家戰略需求走。” 魏少軍說。
  企業需要注意的第二點,魏少軍認為要有勇於創新的決心。
  當前,全球集成電路產業已進入重大調整變革期,給我國集成電路產業發展帶來挑戰的同時,也為實現趕超提供了難得機遇。
  魏少軍認為,企業贏得政策支持的第三個因素就是針對“兩頭在外”,進行產業合作
  “兩頭在外”是集成電路產業的一個奇葩現象。但其原因並不複雜:我們製造企業比較弱,設計企業也比較弱。比較弱的製造企業,就要去找比較強的設計企業去合作。比較弱的設計企業,也要去找比較強的製造企業來合作。兩個都弱,所以“兩頭在外”。
  “還是要製造和設計之間緊密的結合,要有意識的結合。如果不結合,你解決不了兩個在外的問題,大概國家基金投進去也很難。”魏少軍說。

北京大学三井创新论坛 第四十五讲 《创新与信息技术产业发展》
发布时间:2014-09-12 

主讲人:魏少军  清华大学微纳电子学系主任、微电子所所长
                 国家科技重大专项技术总师
                 原大唐电信科技股份有限公司总裁
时间:2014916日(星期二)19:0021:00
地点:北京大学光华管理学院1号楼203多功能厅
主持人:武常岐  北京大学光华管理学院教授
北京大学国家高新技术产业开发区发展战略研究院院长  

演讲嘉宾简介:
    魏少军教授,1958年生于北京。1984年于清华大学无线电电子学系获工学硕士学位,1991年于比利时蒙斯理工学院获应用科学博士学位;现任清华大学、北京大学双聘教授,清华大学微纳电子学系主任、微电子所所长;“核高基”国家科技重大专项技术总师;中国半导体行业协会副理事长,集成电路设计分会理事长;新世纪百千万人才工程国家级人选、享受国务院特殊津贴专家、中国电子学会会士;曾任大唐微电子技术有限公司总经理、董事长,大唐电信科技股份有限公司总经理,电信科学技术研究院总工程师。魏少军博士长期从事集成电路设计方法学、移动计算和可重构计算技术研究。发表论文150余篇,参与3部著作编写。曾获国家科技进步二等奖、北京市科技进步一等奖、中国电子学会科技一等奖,国家知识产权局和世界知识产权组织专利金奖等;先后获全国“五一”劳动奖章、中国科协“求是杰出青年奖”、中组部等六部委颁发的优秀留学回国人员成就奖、“2003中国半导体企业领军人物”、中国集成电路设计产业发展十周年风云人物杰出成就奖、环球资源“推动中国集成电路设计产业发展终身成就奖”等。

论坛简介:
    “北京大学三井创新论坛”由北京大学与日本三井物产株式会社共同举办,由北京大学国家高新技术产业开发区发展战略研究院和三井物产(中国)有限公司承办。本论坛遵循国家“科教兴国战略”的大政方针,坚持走中国特色自主创新道路,深化科技体制改革,不断开创国家创新发展新局面的精神,为推动中国企业界与世界领先强企业之间的交流和中日优秀企业直接搭建一个平台。
担任北京大学三井创新论坛的演讲嘉宾主要来自全球500强企业的主管、副部级以上专家型领导、及在创新方面有独到研究和卓有建树的学者。
    本论坛的举办得到国家发改委、科技部、商务部、北京市政府、北京大学有关领导的大力支持。论坛设立8年以来相继邀请到政府和国内外企业、高校等各界创新人士莅临北大演讲,探讨了热点问题和创新理论,目前已成功举办了44场讲座,形成了积极的影响,已成为了北京大学一个生机勃勃的探讨创新发展的平台。

主办:北京大学                                           三井物产株式会社
承办:北京大学国家高新技术产业开发区发展战略研究院   三井物产(中国)有限公司

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China's IC industry development guideline 2014 --- 国家集成电路产业发展推进纲要

《国家集成电路产业发展推进纲要》正式公布
【发布时间:2014年06月24日 】 【来源:电子信息司】 
  经国务院同意,现将《国家集成电路产业发展推进纲要》公布如下:
国家集成电路产业发展推进纲要
  集成电路产业是信息技术产业的核心,是支撑经济社会发展和保障国家安全的战略性、基础性和先导性产业,当前和今后一段时期是我国集成电路产业发展的重要战略机遇期和攻坚期,为加快推进我国集成电路产业发展,特制定本纲要。

  一、现状与形势
  近年来,在市场拉动和政策支持下,我国集成电路产业快速发展,整体实力显著提升,集成电路设计、制造能力与国际先进水平差距不断缩小,封装测试技术逐步接近国际先进水平,部分关键装备和材料被国内外生产线采用,涌现出一批具备一定国际竞争力的骨干企业,产业集聚效应日趋明显。但是,集成电路产业仍然存在芯片制造企业融资难、持续创新能力薄弱、产业发展与市场需求脱节、产业链各环节缺乏协同、适应产业特点的政策环境不完善等突出问题,产业发展水平与先进国家(地区)相比依然存在较大差距,集成电路产品大量依赖进口,难以对构建国家产业核心竞争力、保障信息安全等形成有力支撑。

  当前,全球集成电路产业正进入重大调整变革期。一方面,全球市场格局加快调整,投资规模迅速攀升,市场份额加速向优势企业集中。另一方面,移动智能终端及芯片呈爆发式增长,云计算、物联网、大数据等新业态快速发展,集成电路技术演进出现新趋势;我国拥有全球规模最大的集成电路市场,市场需求将继续保持快速增长。新形势下,我国集成电路产业发展既面临巨大的挑战,也迎来难得的机遇,应充分发挥市场优势,营造良好发展环境,激发企业活力和创造力,带动产业链协同可持续发展,加快追赶和超越的步伐,努力实现集成电路产业跨越式发展。

  二、总体要求
  (一)指导思想。
  以邓小平理论、“三个代表”重要思想、科学发展观为指导,深入学习领会党的十八大和十八届二中、三中全会精神,贯彻落实党中央和国务院的各项决策部署,使市场在资源配置中起决定性作用,更好发挥政府作用,突出企业主体地位,以需求为导向,以整机和系统为牵引、设计为龙头、制造为基础、装备和材料为支撑,以技术创新、模式创新和体制机制创新为动力,破解产业发展瓶颈,推动集成电路产业重点突破和整体提升,实现跨越发展,为经济发展方式转变、国家安全保障、综合国力提升提供有力支撑。

  (二)基本原则。
  需求牵引。依托市场优势,面向量大面广的重点整机和信息消费需求,提升企业的市场适应能力和有效供给水平,构建“芯片—软件—整机—系统—信息服务”产业链。

  创新驱动。强化企业技术创新主体地位,加大研发力度,结合国家科技重大专项实施,突破一批集成电路关键技术,协同推进机制创新和商业模式创新。

  软硬结合。强化集成电路设计与软件开发的协同创新,以硬件性能的提升带动软件发展,以软件的优化升级促进硬件技术进步,推动信息技术产业发展水平整体提升。

  重点突破。强化市场需求与技术开发的结合,实现涉及国家安全及市场潜力大、产业基础好的关键领域快速发展。

  开放发展。充分利用全球资源,推进产业链各环节开放式创新发展,加强国际交流合作,提升在全球产业竞争格局中的地位和影响力。

  (三)发展目标。  到2015年,集成电路产业发展体制机制创新取得明显成效,建立与产业发展规律相适应的融资平台和政策环境。集成电路产业销售收入超过3500亿元。移动智能终端、网络通信等部分重点领域集成电路设计技术接近国际一流水平。32/28纳米(nm)制造工艺实现规模量产,中高端封装测试销售收入占封装测试业总收入比例达到30%以上,65-45nm关键设备和12英寸硅片等关键材料在生产线上得到应用。

  到2020年,集成电路产业与国际先进水平的差距逐步缩小,全行业销售收入年均增速超过20%,企业可持续发展能力大幅增强。移动智能终端、网络通信、云计算、物联网、大数据等重点领域集成电路设计技术达到国际领先水平,产业生态体系初步形成。16/14nm制造工艺实现规模量产,封装测试技术达到国际领先水平,关键装备和材料进入国际采购体系,基本建成技术先进、安全可靠的集成电路产业体系。

  到2030年,集成电路产业链主要环节达到国际先进水平,一批企业进入国际第一梯队,实现跨越发展。

  三、主要任务和发展重点
  (一)着力发展集成电路设计业。围绕重点领域产业链,强化集成电路设计、软件开发、系统集成、内容与服务协同创新,以设计业的快速增长带动制造业的发展。近期聚焦移动智能终端和网络通信领域,开发量大面广的移动智能终端芯片、数字电视芯片、网络通信芯片、智能穿戴设备芯片及操作系统,提升信息技术产业整体竞争力。发挥市场机制作用,引导和推动集成电路设计企业兼并重组。加快云计算、物联网、大数据等新兴领域核心技术研发,开发基于新业态、新应用的信息处理、传感器、新型存储等关键芯片及云操作系统等基础软件,抢占未来产业发展制高点。分领域、分门类逐步突破智能卡、智能电网、智能交通、卫星导航、工业控制、金融电子、汽车电子、医疗电子等关键集成电路及嵌入式软件,提高对信息化与工业化深度融合的支撑能力。

  (二)加速发展集成电路制造业。抓住技术变革的有利时机,突破投融资瓶颈,持续推动先进生产线建设。加快45/40nm芯片产能扩充,加紧32/28nm芯片生产线建设,迅速形成规模生产能力。加快立体工艺开发,推动22/20nm、16/14nm芯片生产线建设。大力发展模拟及数模混合电路、微机电系统(MEMS)、高压电路、射频电路等特色专用工艺生产线。增强芯片制造综合能力,以工艺能力提升带动设计水平提升,以生产线建设带动关键装备和材料配套发展。

  (三)提升先进封装测试业发展水平。大力推动国内封装测试企业兼并重组,提高产业集中度。适应集成电路设计与制造工艺节点的演进升级需求,开展芯片级封装(CSP)、圆片级封装(WLP)、硅通孔(TSV)、三维封装等先进封装和测试技术的开发及产业化。

  (四)突破集成电路关键装备和材料。加强集成电路装备、材料与工艺结合,研发光刻机、刻蚀机、离子注入机等关键设备,开发光刻胶、大尺寸硅片等关键材料,加强集成电路制造企业和装备、材料企业的协作,加快产业化进程,增强产业配套能力。

  四、保障措施
  (一)加强组织领导。成立国家集成电路产业发展领导小组,负责集成电路产业发展推进工作的统筹协调,强化顶层设计,整合调动各方面资源,解决重大问题。成立咨询委员会,对产业发展的重大问题和政策措施开展调查研究,进行论证评估,提供咨询建议。

  (二)设立国家产业投资基金。国家产业投资基金(以下简称基金)主要吸引大型企业、金融机构以及社会资金,重点支持集成电路等产业发展,促进工业转型升级。基金实行市场化运作,重点支持集成电路制造领域兼顾设计封装测试装备材料环节,推动企业提升产能水平和实行兼并重组、规范企业治理,形成良性自我发展能力。支持设立地方性集成电路产业投资基金。鼓励社会各类风险投资和股权投资基金进入集成电路领域。

  (三)加大金融支持力度。积极发挥政策性和商业性金融的互补优势,支持中国进出口银行在业务范围内加大对集成电路企业服务力度,鼓励和引导国家开发银行及商业银行继续加大对集成电路产业的信贷支持力度,创新符合集成电路产业需求特点的信贷产品和业务。支持集成电路企业在境内外上市融资、发行各类债务融资工具以及依托全国中小企业股份转让系统加快发展。鼓励发展贷款保证保险和信用保险业务,探索开发适合集成电路产业发展的保险产品和服务。

  (四)落实税收支持政策。进一步加大力度贯彻落实《国务院关于印发鼓励软件产业和集成电路产业发展若干政策的通知》(国发〔2000〕18号)和《国务院关于印发进一步鼓励软件产业和集成电路产业发展若干政策的通知》(国发〔2011〕4号),加快制定和完善相关实施细则和配套措施,保持政策稳定性,落实集成电路封装、测试、专用材料和设备企业所得税优惠政策。落实并完善支持集成电路企业兼并重组的企业所得税、增值税、营业税等税收政策。对符合条件的集成电路重大技术装备和产品关键零部件及原材料继续实施进口免税政策,以及有关科技重大专项所需国内不能生产的关键设备、零部件、原材料进口免税政策,适时调整免税进口商品清单或目录。

  (五)加强安全可靠软硬件的推广应用。组织实施安全可靠关键软硬件应用推广计划,以重点突破、分业部署、分步实施为原则,推广使用技术先进、安全可靠的集成电路、基础软件及整机系统。国家扩大内需的各项惠民工程和财政资金支持的重大信息化项目的政府采购部分,应当采购基于安全可靠软硬件的产品。鼓励基础电信和互联网企业采购基于安全可靠软硬件的整机和系统。充分利用扩大信息消费的政策措施,推动基于安全可靠软硬件的各类终端开发应用。面向移动互联网、云计算、物联网、大数据等新兴应用领域,加快构建标准体系,支撑安全可靠软硬件开发与应用。

  (六)强化企业创新能力建设。推动形成产业链上下游协同创新体系,支持产业联盟发展。鼓励企业成立集成电路技术研究机构,联合科研院所、高校开展竞争前共性关键技术研发,引进海外高层次人才,增强产业可持续发展能力。加强集成电路知识产权的运用和保护,建立国家重大项目知识产权风险管理体系,引导建立知识产权战略联盟,积极探索与知识产权相关的直接融资方式和资产管理制度。在集成电路重大创新领域加快形成标准,充分发挥技术标准的作用。

  (七)加大人才培养和引进力度。建立健全集成电路人才培养体系,支持微电子学科发展,通过高校与集成电路企业联合培养人才等方式,加快建设和发展示范性微电子学院和微电子职业培训机构。依托专业技术人才知识更新工程广泛开展继续教育活动,采取多种形式大力培养培训集成电路领域高层次、急需紧缺和骨干专业技术人才。有针对性地开展出国(境)培训项目,推动国家软件与集成电路人才国际培训基地建设。通过现有渠道加强对软件和集成电路人才引进的经费保障。在“千人计划”中进一步加大对引进集成电路领域优秀人才的支持力度,研究出台针对优秀企业家和高素质技术、管理团队的优先引进政策。支持集成电路企业加强与境外研发机构的合作。完善鼓励创新创造的分配激励机制,落实科技人员科研成果转化的股权、期权激励和奖励等收益分配政策。

  (八)继续扩大对外开放。进一步优化环境,大力吸引国(境)外资金、技术和人才,鼓励国际集成电路企业在国内建设研发、生产和运营中心。鼓励境内集成电路企业扩大国际合作,整合国际资源,拓展国际市场。发挥两岸经济合作机制作用,鼓励两岸集成电路企业加强技术和产业合作。

Translated by Google

By the State Council, now the "National Integrated Circuit Industry Development to promote Outline" published as follows: 
IC industry to promote the development of the National Platform 
IC industry is the core of the information technology industry, is to support the economic and social development and the protection of national security, strategic, fundamental and leading industry, current and future period is an important period of strategic opportunities and tackling China's industrial development of integrated circuits, to accelerate the development of China's IC industry, formulated outline. 

First, the status and situation 

In recent years, market driven and policy support, the rapid development of China's IC industry, the overall strength significantly improved, integrated circuit design and manufacturing capabilities with the international advanced level in the gap continued to narrow, packaging and testing technology gradually close to the international advanced level, some key equipment and materials are using domestic production line, and a number with a certain international competitiveness of key enterprises, industrial clustering effect has become more evident. However, the IC industry still exists chip manufacturing enterprises financing difficulties, continuous innovation capability is weak, industrial development and demand of the market, the industry chain lack of coordination, inadequate policy environment to adapt to industry characteristics and other outstanding issues, the level of industrial development and the advanced countries compared to the (regional) still exists a wide gap between IC products rely heavily on imports, it is difficult to form a strong support to build the core competitiveness of the national industry, information security and so on. 

At present, the global IC industry is entering a major adjustment period of change. On the one hand, global market structure to speed up the adjustment of the rapid rise in the scale of investment, market share, competitive enterprises to accelerate the focus. On the other hand, the mobile intelligent terminal and the chip was the explosive growth of cloud computing, networking, big data and other new formats rapid development, the emergence of new trends in the evolution of integrated circuit technology; China has the world's largest integrated market, the market demand will continue to maintain rapid growth. Under the new situation, China's IC industry is facing both huge challenges, but also ushered in a rare opportunity, should give full play to market advantages, to create a good environment for development, stimulate business vitality and creativity, promote the sustainable development of the industrial chain collaboration, accelerate the catch-up and beyond the pace of efforts to achieve the integrated circuit industry by leaps and bounds. 

Second, the general requirements 

(A) guidelines. 

Deng Xiaoping Theory, the important thought of "Three Represents", the scientific concept of development as guidance, thoroughly study and understand the party's 18 and the eighth session of the Second, the Third Plenum of the spirit, the implementation of the decisions and arrangements of the CPC Central Committee and the State Council, make the market play a decisive role in the allocation of resources, better play the role of government, prominent corporate body status, demand-oriented, machine and systems for traction, designed as the leading manufacturer of infrastructure, equipment and materials for the support, technology innovation model innovation and institutional innovation as the driving force to break the bottleneck of industrial development, promoting the integrated circuit industry breakthroughs in key areas and the overall improvement, to achieve leapfrog development, economic development pattern, and national security, to provide strong support to enhance the comprehensive national strength. 

(B) basic principles. 

Demand traction. Relying on market advantage, for the towers, the whole focus of consumer demand, and information to enhance their market adaptability and effective supply levels, build a "chip - Software - machine - system - information services" industry chain. 

Innovation-driven. Strengthen the dominant position of enterprise technology innovation, research and development efforts, combined with the national implementation of major projects technological breakthroughs in key technologies integrated, collaborative mechanism for promoting innovation and business model innovation. 

Flex. Strengthen integrated circuit design and software development collaborative innovation to improve hardware performance driven software development, to promote the optimization and upgrading of software and hardware technology advancement and the level of IT industry as a whole improved. 

Major breakthroughs. Strengthen the combination of market demand and technology development to achieve national security and market potential, the rapid development of a good industrial base in key areas. 

Open development. Make full use of global resources, promote the industry chain of open innovation and development, strengthen international exchanges and cooperation, to enhance competition in the global industry's position and influence. 

(C) development goals. 

By 2015, the IC industry development mechanism innovation system achieved significant results, the establishment of law and industrial development financing platform compatible and policy environment. IC industry sales revenue over 350 billion yuan. Mobile intelligent terminals, network communication and some other key areas of IC design technology closer to world-class level. 32/28 nanometer (nm) manufacturing process to achieve the scale of production, sales of high-end packaging and testing the proportion of total income packaging and testing industry reached more than 30%, 65-45nm key equipment and 12-inch silicon wafers and other key materials to be applied in the production line . 

To 2020, the gap between the integrated circuit industry and the international advanced level and gradually narrow, industry-wide annual sales growth rate of over 20%, significantly enhanced capacity for sustainable development of enterprises. Key areas of mobile intelligent terminals, network communications, cloud computing, networking, data and other large integrated circuit design technology has reached the international advanced level, the initial formation of the industrial ecosystem. 16 / 14nm manufacturing process to achieve the scale of production, packaging and testing technology has reached the international advanced level, key equipment and materials into the international procurement system, basically completed technologically advanced, safe and reliable integrated industrial system. 

By 2030, the main part of the integrated circuit industry chain to reach the international advanced level, a number of enterprises to enter the international first-tier, to achieve leapfrog development. 

Third, the main tasks and development priorities 

(A) focus on the development of IC design industry. Focusing on key areas of the industry chain, strengthen integrated circuit design, software development, system integration, content and services collaborative innovation, driven by the rapid growth of the design development of manufacturing industry. Recent focus mobile intelligent terminal and network communications, the development of large surface wide mobile intelligent terminal chips, digital TV chips, network communications chips, smart wearable device chip and the operating system upgrade IT industry's overall competitiveness. Role of market mechanism to guide and promote the integrated circuit design enterprises mergers and acquisitions. Accelerate cloud computing, networking, emerging field of big data and other core technology research and development based on the new formats, new applications of information processing, sensors, new memory chips and other key cloud operating system and other infrastructure software, to seize the high ground of the future industrial development. Sub-domains, sub-categories and gradually break through smart cards, smart grid, intelligent transportation, satellite navigation, industrial control, financial electronics, automotive electronics, medical electronics, and other key integrated circuits and embedded software, to improve the depth of integration of information technology and industrialization support capabilities. 

(Ii) accelerate the development of integrated circuit manufacturing. Seize the favorable opportunity of technological change, breaking the bottleneck of investment and financing, continue to promote the construction of advanced production lines. Accelerate the 45 / 40nm chip production capacity expansion, intensified 32 / 28nm chip production line construction, the rapid scale production capacity. Accelerate the development of three-dimensional technology to promote 22 / 20nm, 16 / 14nm chip production line construction. To develop simulation and mixed-signal circuits, micro-electromechanical systems (MEMS), high-voltage circuits, RF circuits and other features dedicated production lines. Enhanced integrated chip manufacturing capacity to drive the design process of capacity building to enhance the level, in order to promote the production line supporting the development of key equipment and materials. 

(C) enhance the level of advanced packaging and testing industry. Vigorously promote domestic packaging and testing corporate mergers and acquisitions, increased industrial concentration. Upgrade to adapt to the evolution of demand for integrated circuit design and manufacturing process node, to carry out the chip scale package (CSP), wafer-level packaging (WLP), silicon vias (TSV), three-dimensional package and other advanced packaging and testing technology development and industrialization. 

(D) breakthrough IC key equipment and materials. Strengthen integrated circuit equipment, materials and technology combined R & D lithography, etching machine, ion implantation and other key equipment, the development of the photoresist, the large size wafers and other key materials to enhance IC manufacturers and equipment, materials companies collaboration, accelerate the industrialization process, and enhance industrial supporting capacity. 

Fourth, safeguard measures 

(A) to strengthen the organization and leadership. Establishment of the National Integrated Circuit Industry Development Leading Group, responsible for the development of the integrated circuit industry to promote the co-ordination work, strengthen top-level design, integration mobilize resources to solve major problems. The establishment of the Advisory Committee on major issues and industrial development policies and measures to conduct research, demonstration and assessment conducted to provide advice. 

(B) the establishment of a national industrial investment fund. National Industry Investment Fund (hereinafter referred to as the Fund) is mainly to attract large enterprises, financial institutions and social capital, focusing on the development of integrated circuits and other industries, promote industrial restructuring and upgrading. Fund the implementation of market-oriented operation, focusing on the manufacture of integrated circuits, taking into account the design, packaging and testing, equipment, and materials sectors, encourage enterprises to improve productivity levels and the implementation of mergers and acquisitions, corporate governance norms, forming a virtuous self-development. Support the establishment of local IC industry investment fund. Encourage all types of venture capital and equity investment funds into integrated circuits. 

(C) increase financial support. Actively play complementary strengths policy and commercial finance, and support China Exim Bank to increase the intensity of services integrated enterprise within the business scope, encourage and guide the State Development Bank and commercial banks continued to increase credit support to the integrated circuit industry innovation in line with the demand characteristics of the integrated circuit industry credit products and services. Support IC enterprises listed overseas financing, issuance of various types of debt financing instruments and share transfer system relying on the country to accelerate the development of SMEs. Encourage the development of loan guarantee insurance and credit insurance business, to explore the development of integrated circuits for the industrial development of insurance products and services. 

(D) the implementation of tax support policies. Intensify the implementation of the "State Council issued a number of policies to encourage the software industry and integrated circuit industry notice" (Guo Fa [2000] No. 18) and the "State Council issued further encourage the development of software and IC industry notice a number of policy "(Guo Fa [2011] No. 4), to accelerate the development and improvement of relevant implementing rules and supporting measures to maintain political stability, the implementation of an integrated circuit packaging, testing, special materials and equipment preferential corporate income tax. Implement and improve corporate mergers and acquisitions to support integrated corporate income tax, value added tax, business tax policies. Key equipment to meet the requirements of IC products of major technical equipment and key parts and raw materials continue to implement the import tax policy, as well as major projects related to science and technology is not required for domestic production, spare parts, raw materials imported duty-free policy, adjust the duty-free import of goods list or directory. 

(V) to strengthen the promotion of safe and reliable hardware and software applications. Organization and implementation of key hardware and software applications secure promotion programs to major breakthroughs, sub-sector deployment, step by step implementation of the principle of promoting the use of advanced technology, safety and reliability of integrated circuits, basic software and machine systems. Government procurement of various parts of the country to expand domestic demand and financial funds to support projects that benefit the major information technology projects should purchase a reliable hardware and software-based security products. Encourage basic telecommunications and Internet companies to purchase hardware and software-based security and reliable machine and systems. Take advantage of the expansion of the information consumer policy measures to promote the safe and reliable hardware and software based on the development and application of various types of terminals. Emerging applications for the mobile Internet, cloud computing, networking, big data, accelerate the construction of the standard system, hardware and software development and application support safe and reliable. 

(Vi) strengthening innovation capacity building. Promote the formation of the chain collaborative innovation system and support the development of industry alliances. Encourage enterprises to set up integrated circuit technology research institutions, joint research institutes, colleges and universities to carry out pre-competitive research and development of key technologies in common, the introduction of overseas high-level talents, and enhance capacity for sustainable development of the industry. Strengthen the use and protection of intellectual property ICs, the establishment of national major project risk management system of intellectual property rights, and guide the establishment of a strategic alliance of intellectual property, and actively explore IP-related direct financing and asset management system. Major innovations in the field of IC accelerate the formation of standards, give full play to the role of technical standards. 

(Vii) increased personnel training and the introduction of intensity. Establish a sound IC personnel training system, to support the development of microelectronics disciplines, universities and IC enterprises through joint training of personnel, etc., to accelerate the construction and development of exemplary School of Microelectronics and microelectronic vocational training institutions. Relying on professional and technical personnel to update their knowledge engineering extensive continuing education activities take many forms and vigorously develop high-level training in the field of integrated circuits, badly needed and key professional and technical personnel. To carry out targeted abroad (Habitat) training programs to promote national software and IC Talent International Training Bases. Strengthen the software and integrated circuit talent introduction funding secured through existing channels. In the "people plan" to further increase the inflow of talent ICs support to study the introduction of high-quality technology for outstanding entrepreneurs and management teams to introduce preferential policies. Support IC enterprises to strengthen cooperation with overseas research institutions. Allocation to improve incentives to encourage innovation and creativity, scientific research and the implementation of scientific and technical personnel of the shares, options and other incentive and reward income distribution policies. 

(Viii) continue to expand outside world. Further optimize the environment, efforts to attract the country (territory) outside the capital, technology and talent, encouraging international IC enterprises in the domestic construction and development, production and operations center. Encourage domestic enterprises to expand international cooperation in the integrated circuit, the integration of international resources, expand the international market. Play a role in cross-strait economic cooperation mechanism to encourage enterprises to strengthen cross-strait integrated circuit technology and industrial cooperation.

中國 -- 將投1200億扶持芯片產業 Date 0423 2014 (20Bn USD /time/effective)


中國 中央將投入1200億扶持集成電路產業 中國芯片業有望獲得突破
據中國證券報4月23日報導,和信息安全相關的芯片產業已提升至國家戰略高度,國家將投入巨資支持集成電路產業的發展,規模達1200億元的國家級芯片產業扶持基金有望於近期宣布成立,這一數據超過了我國集成電路產業十年以來科技投入的總和。分析人士表示,有了國家隊資金的護航,集成電路芯片的設備、設計、製造、封裝企業均有望迎來高速發展。
芯片曾被人形像地比喻為國家的“工業糧食”,是信息產業的核心,是所有整機設備的“心臟”。據國際貨幣基金組織測算,芯片1元的產值可帶動相關電子信息產業10元產值,帶來100元的GDP,歐美髮達國家也紛紛將芯片產業列入國家戰略產業。在今年兩會期間,全國人大代表、中國工程院院士、“星光中國芯工程”總指揮鄧中翰在接受采訪時曾說,近年來我國對於擴大了對於集成電路產業投入,一大批企業在過去的10年裡沖向了國際市場。
2013年,我國大陸集成電路產品銷售額佔全球比重已超過三分之一,並逐步形成了“大陸消費市場-大陸終端品牌商-大陸芯片設計-大陸晶圓製造-大陸封裝測試”這一產業鏈需求結構。至於下游國產終端,中華酷聯、小米等國產品牌商也在移動終端時代迅速崛起,2013年我國智能手機廠商出貨量在全球佔比已經超過20%並呈上升態勢,本土集成電路產業也大有從設計業到封測業全面崛起的勢頭。
儘管中國芯片業取得了可喜的進步,但是我國每年進口芯片仍然高達兩千多億美元。根據海關總署在2014年1月公佈的數據,2013年全年我國集成電路進口額為2322億美元,比上年同期的1724.99億美元增長了34.6%;逆差達到1441億美元,較上年同期的1391億美元擴大了50億美元,連續第四年擴大。而同2013年相比,2014年雖然中國原油進口量繼續大幅增長,但進口額為2196億美元,較去年同期下降了0.5%。這也說明,2014年我國芯片進口額與石油進口額的比例也在進一步擴大。
在此前提下,集成電路產業發展也成為了2014年我國政府的重點工作之一。今年3月,由中國半導體行業協會、中國電子信息產業發展研究院等共同主辦的“2014中國半導體市場年會暨第三屆中國集成電路產業創新大會(IC Market China 2014)”在無錫召開。
會上工信部電子司副司長彭紅兵表示,國家對半導體與集成電路產業發展高度重視,近期要密集出台一系列扶持集成電路行業發展的政策,並透露了政策扶持的四大方向。具體包括:建立中央和各地方政府扶持政策的協調長效機制;解決長期困擾集成電路產業發展的投融資瓶頸問題,從資本市場尋找更多資源,用政策引導社會資金投入;鼓勵創新;加強對外開放,鼓勵國內外企業積極合作,用政策引導提高合作質量。
業內人士坦言,資金成為目前製約集成電路行業發展的主要瓶頸。 “我國集成電路產業十年以來科技投入1000多億元,但相比國際大企業,國內全行業投入只是英特爾的1/6。”他表示,資本在促進集成電路產業發展的重要性和必要性已經獲得認可,通過政府財政引導加股權投資基金協同運作的方式被認為是有效手段。
正是在這一思路的指引下,國家芯片產業扶持基金有望於近期宣布成立,規模將達到1200億元。國家財政撥款400億元,其餘資金依靠社會募資。而據中國證券報記者了解,國家目前已經編制完成《促進集成電路產業發展綱要》,明確以財政扶持和股權投資基金方式並重支持集成電路產業發展。
業內人士稱,目前多家央企有望成為該基金的發起人,中國煙草、移動運營商以及芯片封裝等實力派企業均位列其中。基金將採取公司化運作,專業化運營,重點支持集成電路芯片的設備、設計、製造、封裝等細分領域。 “1200億元的產業扶持基金的成立,將超過十年的研發投入。這將大大縮小和發達國家在芯片產業資金投入的差距。”上述人士稱。
分析人士認為,芯片國產化的大趨勢已經不可逆轉,相關方面的資金投入將有望實現幾何級增長。在此背景下,核心技術的突破和國產化將進入高峰期。包括雲計算、物聯網、大數據、數字電視等重要領域的芯片,均將有望實現進口替代。產業鏈條上,集成電路芯片的設備、設計、製造、封裝企業,均有望迎來高速發展。而“國家版”扶持政策的提出,無疑將對地方的扶持政策具有重要的示範和推動效應。據悉,多個地方將出台半導體產業發展規劃以及相關招商引資和扶持政策,並且成立相關產業發展基金。
http://www.guancha.cn/Industry/2014_04_23_224392.shtml

  • 2014-08-19 Web only    文/王曉玟 http://m.cw.com.tw/article/article.action?id=5060461
下一個剿滅對象:聯發科
8月中,中國更對蘋果iPhone供應商豪威(OmniVision)發出公開收購要約,直接瞄準台灣半導體的上游客戶群,壯大自己下游晶圓代工與封測業的戰力。
業界甚至揣測,中國大陸發改委最近認定,全球IC設計龍頭高通遭反壟斷之後,「下一個被點名要剿滅的對象,就是聯發科,」一位台灣業界專家私底下透露。
蕞爾小島台灣,30年之內,躍升為全球第二大半導體強國,僅次美國。更培育出全球晶圓代工冠軍台積電、全球第二大IC設計企業聯發科技。為什麼中國大陸一個剛出爐的產業政策,就讓台灣逾兩兆台幣產值的半導體業,如臨大敵?
有形之手  結合無形之手
首先,這是力道最強的產業政策。
「這是一個高風險、高投入、對國家有戰略意義的行業,但我們很長時間每年的投入,只夠修2公里的地鐵,」中國《新世紀》週刊報導。而《推進綱要》將成立的1200億人民幣投資基金,足足可以蓋4座28奈米製程晶圓廠。金額創下史上新高。
其次,和過去的鼓勵政策不同,中國政府這次自己擔綱主角。
「過去是鼓勵政策,政府是旁觀者,企業是主角。你要不要接受這鼓勵政策,是企業做決定。《推進綱要》是政府要帶頭做這件事,責任主體是政府,」參與《推進綱要》起草工作的北京清華大學微電子所所長魏少軍告訴《天下》。
「這一千兩百億人民幣是『投資基金』,不是『發展基金』,」魏少軍強調。他解釋,過去鼓勵政策不涉及股權,但現在以投資基金運作,就會擁有與投資金額相對的企業股權,並要求投資報酬率,用股權結構進一步改變企業結構、產業結構。
終結「空芯現象」
中國雖然早在10年前就躍居全球IC消費最大國,但中國半導體發展仍處處受制於人。根據市調機構IC Insights預估,2017年中國半導體市場將有7成至8成,仍仰賴進口。讓中國政府頭疼的是,前年,中國進口了2322億美元的IC。這金額,比中國購買石油的外匯還要高。
「對於具備戰略和軍事意義的高端集成電路,花再大的價錢也買不來,」《新世紀》週刊報導,這是中國的「空芯現象」,只能被國際巨頭牽著鼻子走。
台灣的隱形優勢
面對中國崛起,失去了員工分紅配股、號召年輕人魅力的台灣半導體業,無法再單憑創業精神、技術領先求勝。
「產業起不起得來,跟政策比較無關,還是要看企業自己強不強,」曾任台積電行銷副總、到深圳創業的胡正大,感觸很深。他眼見中國政策大力扶植太陽能、LED產業,卻造就全球產能過剩的泡沫。
曾經支撐起台灣半導體一片天的大學教育、工程師人才、企業的誠信文化、國家的智慧財產權制度,這些隱形優勢,不僅是美國目前遙遙領先的箇中原因,更是台灣和中國一爭高下的關鍵

台積電Q3獲利創新高 Q4營收季增上看逾5% TSMC Q3 2014 2.54Bn net profit ,accum 6.1Bn profit(after tax)

2014-10-16  14:47 http://news.ltn.com.tw/news/business/breakingnews/1132857
〔記者洪友芳/台北報導〕晶圓代工大廠台積電 (2330) 第3季季毛利率攀高到50.5%,創近4年來新高,單季稅後盈餘達763.35億元,為單季歷史新高,季增27.9%,每股盈餘2.94元,累計前3季稅後盈餘達1839.08億元,每股盈餘達7.09元。第4季營收預估將達2170億元到2200億元,季增3.8%到5.2%,但受20奈米製程產能提升影響,毛利率與營業利益率則較上季略減。
台積電下午召開法說會並公布第3季財報,營收與獲利均創新高,單季營收2090.49億元,季增14.2%,年增28.6%;稅後盈餘763.35億元,季增27.9%,年增46.9%;每股盈餘2.94元。
若以美元計算,台積電第3季營收較上季增加14.7%,較去年同期則增加28.1%;毛利率為50.5%,達到公司預估的高標,營業利益率為40.4%,超過預估的39.5%高標,並皆超過上季毛利率49.8%與營業利益率的38.6%。
台積電表示,第3季20奈米製程出貨佔公司當季晶圓銷售的9%;28奈米製程出貨佔全季晶圓銷售的34%。上述先進製程(包含28/20奈米製程)的營收達到全季晶圓銷售金額的43%。
台積電累計前3季營收達5402.85億元,稅後盈餘達1839.08億元,每股盈餘達7.09

張忠謀:半導體下一波競爭威脅 來自中國

2014-10-21  12:47 http://news.ltn.com.tw/news/business/breakingnews/1136581
〔本報訊〕台積電(2330)董事長張忠謀日前接受《華爾街日報》專訪,訪問時指出,隨著中國崛起,中國將是半導體業下一波競爭威脅所在。
張忠謀表示,近期中國國力不斷增長,當地產業也不斷向國外學習、吸取經驗,加上政府大力扶持在地產業,讓他們的競爭力迅速提高,尤其是半導體產業,中國政府不僅投入人民幣1,200億元(約新台幣5,934億元)(20Bn),還有通盤的政策規劃呼應,可說是來勢洶洶。
  • 台積電董事長張忠謀日前接受《華爾街日報》專訪,訪問時指出,隨著中國崛起,中國將是半導體業下一波競爭威脅所在。(資料照,記者劉信德攝)
    台積電董事長張忠謀日前接受《華爾街日報》專訪,訪問時指出,隨著中國崛起,中國將是半導體業下一波競爭威脅所在。(資料照,記者劉信德攝)
不過面對中國崛起,台積電絲毫不畏懼,張忠謀指出,在半導體業中,技術及專利是公司最重要的資產,若能不斷研發新技術、保護智慧產權,在產業中將能保有長期優勢,而台積電也正朝這個方向努力。
此外,對於如何因應中國、南韓來台挖角,張忠謀也表示,台積電有很好的利潤分享計畫,相信能留住人才。
而談到未來的接班計畫,張忠謀也明白指出,不覺得從企業外找接班人是可行的方法,同時也認為,公司內部不會喜歡這個想法。
至於產業未來的發展,張忠謀再次表示,物聯網將是半導體業未來的發展關鍵,而台積電也正努力投入研發,預估台積電全球晶圓代工市占率明年可提升至55%,對自家公司後市展望相當有信心。